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US 12,438,121 B2Granted
Sintering materials and attachment methods using same
AssigneeAlpha Assembly Solutions Inc.
InventorsOscar Khaselev, Bawa Singh, Bin Mo, Michael T. Marczi, Monnir Boureghda
Life of this patent
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Abstract
Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.
Claims15
A method for attachment, comprising:
- applying a film of metal particles to a polymeric, glass, metal, paper, or ceramic substrate, wherein applying the film comprises casting the film;
- drying the film on the polymeric, glass, metal, paper, or ceramic substrate;
- transferring the dried film by a lamination process at a temperature of from about 50 to about 175° C. and a pressure of from about 0.05 to about 3 MPa directly from the polymeric, glass, metal, paper, or ceramic substrate to a substrate which will subsequently receive one or more components comprising a die, wherein the dried film is in contact with the polymeric, glass, metal, paper, or ceramic substrate during lamination to the substrate which will subsequently receive said one or more components;
- placing said one or more components on the transferred film to form an assembly;
- applying a pressure of from about 0.5 MPa to about 20 MPa to the assembly;
- and
- sintering the assembly at a temperature of about 175 to about 400° C. for about 0.25 seconds to about 30 minutes;
- wherein the film comprises a composition comprising:
- a metal powder having a d50 range of 0.001 to 10 micrometers, the metal powder comprising 30 to 95 wt. % of the composition;
- and
- a binder having a softening point between about 90° C. and 170° C., the binder comprising 0.1 to 0.8 wt. % of the composition;
- wherein the composition has a viscosity of from about 10 to about 200,000 cP.
9 more elements
Dependencies are inferred from the claim text.