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US 2024/0234366 A9Published application
Circuit board and manufacturing method
AssigneeNHK Spring Co., Ltd.
InventorsRyo TANAKA, Yuichiro YAMAUCHI, Kohei SUZUKI
Life of this patent
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Abstract
A circuit board having a circuit pattern on a base plate and an additional metal layer laid and bonded on the circuit pattern, wherein the additional metal layer comprises an attachment plane portion configured to fix a semiconductor chip using solder, and an engagement uneven portion provided adjacent to the attachment plane portion, wherein the attachment plane portion is a face having unevenness smaller than the engagement uneven portion.
Claims16
A circuit board comprising:
- a circuit pattern on a base plate and an additional metal layer layered and bonded on the circuit pattern, wherein
- the additional metal layer comprises:
- an attachment plane portion configured to fix an electronic component using solder;
- and
- an engagement uneven portion provided adjacent to the attachment plane portion to be engaged with a tool uneven portion of a tool for vibration transmission to bond the additional metal layer on the circuit pattern with ultrasonic vibration, wherein
- the attachment plane portion is a face having unevenness smaller than the engagement uneven portion.
3 more elements
Dependencies are inferred from the claim text.