H10W 72/07336
Soldering or alloying
Official title: {Soldering or alloying}
H10W72/07336 (Soldering or alloying) appears on 3,425 US grants and 3,867 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,425
- Published applications
- 3,867
- Assignees
- 837
- Inventors
- 6,037
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 14 | 0 |
| 1978 | 9 | 0 |
| 1979 | 3 | 0 |
| 1980 | 9 | 0 |
| 1981 | 8 | 0 |
| 1982 | 6 | 0 |
| 1983 | 4 | 0 |
| 1984 | 7 | 0 |
| 1985 | 9 | 0 |
| 1986 | 7 | 0 |
| 1987 | 9 | 0 |
| 1988 | 13 | 0 |
| 1989 | 19 | 0 |
| 1990 | 13 | 0 |
| 1991 | 20 | 0 |
| 1992 | 18 | 0 |
| 1993 | 15 | 0 |
| 1994 | 15 | 0 |
| 1995 | 9 | 0 |
| 1996 | 10 | 0 |
| 1997 | 10 | 0 |
| 1998 | 21 | 0 |
| 1999 | 15 | 0 |
| 2000 | 22 | 0 |
| 2001 | 22 | 15 |
| 2002 | 20 | 51 |
| 2003 | 30 | 44 |
| 2004 | 43 | 73 |
| 2005 | 48 | 88 |
| 2006 | 51 | 112 |
| 2007 | 63 | 155 |
| 2008 | 64 | 138 |
| 2009 | 68 | 151 |
| 2010 | 119 | 121 |
| 2011 | 118 | 151 |
| 2012 | 144 | 186 |
| 2013 | 150 | 188 |
| 2014 | 183 | 233 |
| 2015 | 220 | 267 |
| 2016 | 224 | 244 |
| 2017 | 225 | 181 |
| 2018 | 157 | 161 |
| 2019 | 169 | 181 |
| 2020 | 155 | 211 |
| 2021 | 171 | 254 |
| 2022 | 174 | 248 |
| 2023 | 163 | 141 |
| 2024 | 150 | 122 |
| 2025 | 136 | 80 |
| 2026 | 60 | 71 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Package with low-warpage carrier6 Oct 2026US 12,757,756 B2Infineon Technologies AG
- Electronic package with improved heat dissipating and manufacturing method thereof22 Sep 2026US 12,745,630 B2Siliconware Precision Industries Co., Ltd.
- Cleaning liquid and method for manufacturing semiconductor device8 Sep 2026US 12,729,348 B2Kabushiki Kaisha Toshiba
- Mounting arrangements for semiconductor packages and related methods1 Sep 2026US 12,727,295 B2CreeLED, Inc.
- Insulating circuit board and semiconductor device using same25 Aug 2026US 12,721,197 B2Niterra Materials Co., Ltd.
- Semiconductor device and method of manufacturing semiconductor device8 Oct 2026US 2026/0314437 A1Mitsubishi Electric Corporation
- Thermal interface material bleed control for heat spreaders1 Oct 2026US 2026/0305388 A1Intel Corporation
- Delamination/cracking improvement at solder joints in microelectronics package1 Oct 2026US 2026/0305441 A1Qorvo US, Inc.
- Method of manufacturing semiconductor devices and corresponding semiconductor device1 Oct 2026US 2026/0305498 A1STMicroelectronics International N. V.
- Heat-dissipating semiconductor package with embedded heat-conducting member, method for manufacturing the same, and induction-heating soldering device used in manufacturing the same24 Sep 2026US 2026/0293670 A1Bs Technics Co., Ltd.
Most cited
By later US patents
- Fabrication process of semiconductor package and semiconductor package390US 5,976,912 AHitachi Chemical Company, Ltd. · 1999
- Leadless semiconductor device and method for making the same346US 5,172,214 AMotorola, Inc. · 1992
- Method of making a cavity ball grid array apparatus317US 6,326,244 B1Micron Technology, Inc. · 2001
- Method of forming a multi-layer semiconductor structure incorporating a processing handle member291US 7,307,003 B2Massachusetts Institute of Technology · 2007
- Semiconductor device including cladded base plate274US 8,963,321 B2Infineon Technologies AG · 2015