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US 12,721,197 B2Granted
Insulating circuit board and semiconductor device using same
AssigneeNiterra Materials Co., Ltd.
InventorsKazumitsu Morimoto, Hideaki Hirabayashi
Life of this patent
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Abstract
According to the embodiment, in an insulating circuit board in which a conductor part is bonded to at least one surface of an insulating substrate, in XPS analysis of the carbon amount at the surface of the conductor part, the average value of the carbon amounts at any three locations is within the range of not less than 0 at % and not more than 70 at %. In XPS analysis of the oxygen amount of the conductor part surface, it is favorable for the average value of any three locations to be within the range of not less than 3 at % and not more than 50 at %.
Claims18
An insulating circuit board, comprising:
- a ceramic substrate;
- and
- a copper member bonded to at least one surface of the ceramic substrate the copper member being made of copper or a copper alloy,
- wherein the copper member and the ceramic substrate are bonded via a bonding layer including titanium,
- when XPS analysis of a carbon amount at a surface of the copper member is performed, an average value of the carbon amounts at any three locations being within a range of not less than 0 at % and not more than 70 at %, and
- when XPS analysis of an oxygen amount at the surface of the copper member is performed, an average value of the oxygen amounts at the three locations is within a range of not less than 3 at % and not more than 50 at %.
3 more elements
Dependencies are inferred from the claim text.