Mounting arrangements for semiconductor packages and related methods

A method comprising:

• providing a substrate with a metal pad;
• selectively applying a solder material to a first portion of the metal pad and a second portion of the metal pad, wherein the solder material forms at least two discrete regions on the first portion of the metal pad;
• mounting a first semiconductor package offset relative to the at least two discrete regions of the solder material on the first portion of the metal pad such that the first semiconductor package laterally overhangs the solder material, and mounting a second semiconductor package offset relative to the solder material on the second portion of the metal pad such that the second semiconductor package laterally overhangs the solder material, wherein the second semiconductor package is laterally spaced from the first semiconductor package by a first distance;
• and
• reflowing the solder material such that the solder material at the first portion of the metal pad and the solder material at the second portion of the metal pad spread toward one another along the metal pad such that the first semiconductor package is laterally spaced from the second semiconductor package by a second distance that is less than the first distance, and the at least two discrete regions of the solder material on the first portion of the metal pad join together.