H10W 72/07337
Using a polymer adhesive
Official title: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy}
H10W72/07337 (Using a polymer adhesive) appears on 4,548 US grants and 4,900 published applications in this corpus.
Search patents in H10W- Granted patents
- 4,548
- Published applications
- 4,900
- Assignees
- 1,039
- Inventors
- 7,712
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 9 | 0 |
| 1978 | 5 | 0 |
| 1979 | 6 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 12 | 0 |
| 1983 | 8 | 0 |
| 1984 | 11 | 0 |
| 1985 | 9 | 0 |
| 1986 | 11 | 0 |
| 1987 | 13 | 0 |
| 1988 | 14 | 0 |
| 1989 | 20 | 0 |
| 1990 | 24 | 0 |
| 1991 | 28 | 0 |
| 1992 | 34 | 0 |
| 1993 | 20 | 0 |
| 1994 | 31 | 0 |
| 1995 | 26 | 0 |
| 1996 | 26 | 0 |
| 1997 | 26 | 0 |
| 1998 | 52 | 0 |
| 1999 | 53 | 0 |
| 2000 | 78 | 0 |
| 2001 | 82 | 27 |
| 2002 | 78 | 120 |
| 2003 | 80 | 108 |
| 2004 | 96 | 112 |
| 2005 | 91 | 172 |
| 2006 | 112 | 181 |
| 2007 | 105 | 186 |
| 2008 | 104 | 209 |
| 2009 | 108 | 205 |
| 2010 | 167 | 194 |
| 2011 | 165 | 224 |
| 2012 | 170 | 226 |
| 2013 | 197 | 207 |
| 2014 | 203 | 241 |
| 2015 | 230 | 301 |
| 2016 | 229 | 275 |
| 2017 | 228 | 220 |
| 2018 | 195 | 195 |
| 2019 | 197 | 226 |
| 2020 | 243 | 285 |
| 2021 | 193 | 267 |
| 2022 | 188 | 252 |
| 2023 | 202 | 143 |
| 2024 | 177 | 148 |
| 2025 | 116 | 101 |
| 2026 | 68 | 75 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Dicing die attach film and method of producing the same, and semiconductor package and method of producing the same29 Sep 2026US 12,751,310 B2Furukawa Electric Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices29 Sep 2026US 12,751,321 B2Amkor Technology Singapore Holding Pte.Ltd.
- Adhesive bonding composition and method of use1 Sep 2026US 12,722,358 B2Immunolight, LLC
- Package structure and method for fabricating the same1 Sep 2026US 12,727,477 B2Wistron Neweb Corp.
- Package with solder mask1 Sep 2026US 12,727,487 B2NXP USA, Inc.
- A thermal interface material, an integrated circuit formed therewith, and a method of application thereof8 Oct 2026US 2026/0314406 A1Arieca Inc.
- Semiconductor device and method for producing semiconductor device8 Oct 2026US 2026/0314503 A1Resonac Corporation
- Stacked semiconductor die assemblies with die support members and associated systems and methods1 Oct 2026US 2026/0305487 A1Micron Technology, Inc.
- Film adhesive, dicing/die attach film, semiconductor device, and production method for same24 Sep 2026US 2026/0293603 A1Resonac Corporation
- Clips for semiconductor package and related methods24 Sep 2026US 2026/0293708 A1Semiconductor Components Industries, LLC
Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Method for fabricating an integrated circuit module849US 5,353,498 AGeneral Electric Company · 1994
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Fan-out PoP structure with inconsecutive polymer layer720US 9,461,018 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stretchable form of single crystal silicon for high performance electronics on rubber substrates525US 7,521,292 B2The Board of Trustees of the University of Illinois · 2009