H10W 72/07339
Hardening the adhesive by cooling
Official title: {hardening the adhesive by cooling, e.g. thermoplastics}
H10W72/07339 (Hardening the adhesive by cooling) appears on 174 US grants and 178 published applications in this corpus.
Search patents in H10W- Granted patents
- 174
- Published applications
- 178
- Assignees
- 97
- Inventors
- 398
- Latest grant
- 10 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 6 | 1 |
| 2002 | 4 | 0 |
| 2003 | 0 | 7 |
| 2004 | 2 | 4 |
| 2005 | 0 | 5 |
| 2006 | 2 | 6 |
| 2007 | 7 | 10 |
| 2008 | 6 | 11 |
| 2009 | 9 | 14 |
| 2010 | 11 | 14 |
| 2011 | 12 | 8 |
| 2012 | 7 | 4 |
| 2013 | 4 | 3 |
| 2014 | 6 | 4 |
| 2015 | 2 | 4 |
| 2016 | 7 | 12 |
| 2017 | 5 | 10 |
| 2018 | 7 | 12 |
| 2019 | 10 | 10 |
| 2020 | 14 | 14 |
| 2021 | 9 | 9 |
| 2022 | 8 | 8 |
| 2023 | 5 | 6 |
| 2024 | 6 | 2 |
| 2025 | 4 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Display device including a wiring pad and method for manufacturing the same10 Feb 2026US 12,550,445 B2Samsung Display Co., Ltd.
- Light induced selective transfer of components between substrates30 Sep 2025US 12,431,381 B2Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Method of manufacturing electric device1 Jul 2025US 12,349,505 B2Electronics and Telecommunications Research Institute
- Adhesive member, display device, and manufacturing method of display device8 Apr 2025US 12,272,667 B2Samsung Display Co., Ltd.
- Printed circuit board and electronic component package including the same28 Jan 2025US 12,211,816 B2Samsung Electro-Mechanics Co., Ltd.
- Method of deposition of a thermal interface material onto a circuit assembly and an integrated circuit formed therefrom20 Jun 2024US 2024/0203754 A1Arieca Inc.
- Adhesive member, display device, and manufacturing method of display device18 Apr 2024US 2024/0128224 A1Samsung Display Co., Ltd.
- Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths7 Dec 2023US 2023/0395463 A1Micron Technology, Inc.
- Printed circuit board and electronic component package including the same3 Aug 2023US 2023/0245989 A1Samsung Electro-Mechanics Co., Ltd.
- Display device including a wiring pad and method for manufacturing the same29 Jun 2023US 2023/0207573 A1Samsung Display Co., Ltd.
Most cited
By later US patents
- Method for making an electronic module391US 5,745,984 AMartin Marietta Corporation · 1998
- Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer242US 5,286,679 AMicron Technology, Inc. · 1994
- Dissimilar adhesive die attach for semiconductor devices210US 5,304,842 AMicron Technology, Inc. · 1994
- Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices177US 7,259,030 B2Articulated Technologies, LLC · 2007
- Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape143US 5,140,404 AMicron Technology, Inc. · 1992