Method for making an electronic module
AssigneeMartin Marietta Corporation
InventorsHerbert Stanley Cole, Jr., Theresa Ann Sitnik-Nieters
Life of this patent
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Abstract
A multi-chip module is provided which utilizes benzocyclobutene as a laminate adhesive for bonding the upper dielectric films in a high density interconnect structure. The benzocyclobutene thermosetting polymer is spin coated on a polyimide film, and baked at low temperature to remove any solvent to leave a B-staged coating on the polyimide film. The composite film can be laminated to an underlying electrical structure using a vacuum laminator and heat. As the heat is applied, the BCB layer softens, flows and then cures to bond the polyimide film to the underlying electrical structure.
Claims8
A method for making an electronic circuit module, comprising the steps of:
- disposing a plurality of electronic chips on a substrate, the chips including contact pads;
- adhesively laminating a first thermoset polymer film layer, over the chips and areas of the substrate surface surrounding the chips, with a thermoplastic adhesive;
- providing a plurality of via openings over at least some of the contact pads in the first polymer film/adhesive layer;
- providing a first pattern of electrical conductors on the first film layer so that conductors extend between the via openings so as to electrically connect selected contact pads;
- adhesively laminating at least one additional polymer film over at least a portion of each of the first polymer film layer and the first electrical conductor pattern, with a benzocyclobutene polymer adhesive;
- providing a plurality of additional via openings in each additional polymer/benzocyclobutene polymer film, the openings being disposed over at least some of electrical conductors of an associated next lower layer;
- and
- providing an additional pattern of electrical conductors on each of the at least one additional polymer film so that conductors extend into the associated via openings so as to electrically connect with some of the electrical conductors of the associated next lower layer.
Dependencies are inferred from the claim text.