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US 12,211,816 B2Granted
Printed circuit board and electronic component package including the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYoung Kuk Ko, Sang Hoon Kim, Suk Chang Hong, Chi Won Hwang, Gyu Mook Kim
Life of this patent
Estimating the term…
Abstract
A printed circuit board includes: a first insulating layer; a first cavity disposed in one surface of the first insulating layer; a plurality of protrusion portions spaced apart from each other in the first cavity; and a first wiring layer embedded in the one surface of the first insulating layer.
Claims20
A printed circuit board comprising:
- a first insulating layer;
- a first cavity disposed in one surface of the first insulating layer;
- a plurality of protrusion portions in the first cavity;
- and
- a first wiring layer embedded in the one surface of the first insulating layer,
- wherein the plurality of protrusion portions comprise an insulating material, and
- wherein at least one of the plurality of protrusion portions is integral with the first insulating layer.
4 more elements
An electronic component package comprising:
- a first printed circuit board including an insulating layer, a first cavity disposed in one surface of the insulating layer, and a plurality of protrusion portions spaced apart from each other in the first cavity;
- a second printed circuit board disposed on one side of the first printed circuit board in a stacking direction, the second printed circuit board having one surface on which the first printed circuit board is mounted;
- an electronic component mounted on the one surface of the second printed circuit board;
- and
- first electrical connection metals disposed between the second printed circuit board and the electronic component,
- wherein the one surface of the insulating layer of the first printed circuit board is in contact with the electronic component,
- wherein the plurality of protrusion portions comprise an insulating material,
- wherein at least one of the plurality of protrusion portions is integral with the insulating layer, and
- wherein (1) the first electrical connection metals overlap the electronic component in the stacking direction or (2) the first electrical connection metals contact the electronic component.
6 more elements
Dependencies are inferred from the claim text.