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US 2023/0245989 A1Published application
Printed circuit board and electronic component package including the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYoung Kuk Ko, Sang Hoon Kim, Suk Chang Hong, Chi Won Hwang, Gyu Mook Kim
Life of this patent
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Abstract
A printed circuit board includes: a first insulating layer; a first cavity disposed in one surface of the first insulating layer; a plurality of protrusion portions spaced apart from each other in the first cavity; and a first wiring layer embedded in the one surface of the first insulating layer.
Claims8
A printed circuit board comprising:
- a first insulating layer;
- a first wiring layer embedded in one surface side of the first insulating layer, and having one surface exposed to the one surface of the first insulating layer;
- and
- a cavity formed in the one surface of the first insulating layer;
- wherein a roughness of bottom surface of the cavity is greater than a roughness of the one surface of the first wiring layer.
2 more elements
Dependencies are inferred from the claim text.