Method of manufacturing electric device

A method for manufacturing an electronic device, the method comprising:

• mapping good elements and defective elements on a substrate;
• providing a first transparent structure comprising a first adhesive layer on the substrate;
• selectively providing first laser light to the defective elements to cure the first adhesive layer on the defective elements and separate the defective elements from the substrate;
• providing a second transparent structure comprising a second adhesive layer, which adheres to new elements replaced for the defective elements, on the substrate;
• and
• selectively providing second laser light to the new elements to bond the new elements to the substrate,
• wherein the first laser light comprises ultraviolet light, and
• the second laser light comprises infrared light.

A method for manufacturing an electronic device, the method comprising:

• mapping good elements and defective elements on a substrate;
• providing a first transparent structure comprising a first adhesive layer on the substrate;
• allowing the first adhesive layer to be in contact with the good elements and the defective elements;
• selectively providing ultraviolet light to the defective elements to fix the defective elements to the first transparent structure by the first adhesive layer and separate the defective elements from the substrate;
• providing a second transparent structure comprising a second adhesive layer, which adheres to new elements replaced for the defective elements, on the substrate;
• and
• allowing the new elements to be in contact with the substrate;
• and
• selectively providing ultraviolet light or infrared light to the new elements to bond the new elements to the substrate.