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US 2026/0293708 A1Published application
Clips for semiconductor package and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsInpil YOO, Seungwon IM, Jooyang EOM, Jerome TEYSSEYRE
Life of this patent
Estimating the term…
Abstract
Implementations of a clip may include a first copper layer directly bonded to a first side of a ceramic layer, a second copper layer directly bonded to a second side of the ceramic layer, the second side of the ceramic layer opposite the first side of the ceramic layer, and a plurality of channels partially etched into a thickness of the second copper layer.
Claims20
A method of forming a semiconductor package comprising:
- coupling a semiconductor die onto a substrate;
- positioning one or more clips over the semiconductor die using a jig coupled around the semiconductor die and the substrate;
- and
- coupling the one or more clips over the semiconductor die and over a portion of the substrate;
- wherein the one or more clips are direct bond copper (DBC) clips.
2 more elements
A method of forming a semiconductor package comprising:
- coupling a plurality of semiconductor die onto a substrate;
- coupling a jig around the plurality of semiconductor die and the substrate;
- using the jig, positioning a first direct bond copper (DBC) clip directly over two or more semiconductor die of the plurality of semiconductor die;
- and
- using the jig, positioning a second direct bond copper (DBC) clip directly over two or more semiconductor die of the plurality of semiconductor die.
2 more elements
A method of forming a semiconductor package comprising:
- coupling a plurality of semiconductor die onto a substrate;
- coupling a jig around the plurality of semiconductor die and the substrate;
- using the jig, positioning a first direct bond copper (DBC) clip directly over two or more semiconductor die of the plurality of semiconductor die;
- using the jig, positioning a second direct bond copper (DBC) clip directly over two or more semiconductor die of the plurality of semiconductor die;
- and
- coupling the first DBC clip and the second DBC clip over the plurality of semiconductor die and directly over and to a portion of the substrate.
3 more elements
Dependencies are inferred from the claim text.