Stacked semiconductor die assemblies with die support members and associated systems and methods
AssigneeMicron Technology, Inc.
InventorsSeng Kim Ye, Hong Wan Ng
Life of this patent
Estimating the term…
Abstract
Stacked semiconductor die assemblies with die support members and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a package substrate, a first semiconductor die attached to the package substrate, and a support member attached to the package substrate. The support member can be separated from the first semiconductor die, and a second semiconductor die can have one region coupled to the support member and another region coupled to the first semiconductor die.
Claims20
A semiconductor die assembly, comprising:
- a package substrate;
- a first elongate support member on the package substrate having a first length greater than a first width;
- a second elongate support member on the package substrate having a second length greater than a second width, wherein the second length is generally perpendicular to the first length;
- a controller die on the package substrate and spaced laterally apart from the first and second elongate support members, wherein the controller die includes a first plurality of bond pads;
- and
- a memory die mounted to the first and second elongate support members and the controller die,
- wherein a first bond pad of the first plurality of bond pads is vertically aligned with the memory die and a second bond pad of the first plurality of bond pads is not vertically aligned with the memory die.
A semiconductor die assembly, comprising:
- a package substrate including a plurality of bond pads;
- a first support member on the package substrate, the first support member having a first long side extending in a first direction;
- a second support member on the package substrate, the second support member having a second long side extending in a second direction perpendicular to the first direction;
- a controller die on the package substrate and laterally spaced apart from the first and second support members;
- and
- a memory die carried by the first support member, the second support member, and the controller die,
- wherein a one or more first bond pads of the plurality of bond pads are vertically aligned with the memory die and one or more second bond pads of the plurality of bond pads are not vertically aligned with the memory die.
A method of manufacturing a semiconductor die assembly, comprising:
- coupling a first plurality of bond pads of a controller die to a second plurality of bond pads on a package substrate;
- attaching a first support member to the package substrate, the first support member having a first length greater than a first width;
- attaching a second support member to the package substrate, the second support member having a second length greater than a second width, wherein the second support member is positioned generally perpendicular to the first support member;
- and
- mounting a memory die to the first support member, the second support member, and the controller die,
- wherein at least a first bond pad of the first plurality of bond pads is vertically aligned with a footprint of the memory die, and wherein at least a second bond pad of the first plurality of bond pads is outside of the footprint of the memory die.
Dependencies are inferred from the claim text.