H10W 72/07338
Hardening the adhesive by curing
Official title: {hardening the adhesive by curing, e.g. thermosetting}
H10W72/07338 (Hardening the adhesive by curing) appears on 2,124 US grants and 2,496 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,124
- Published applications
- 2,496
- Assignees
- 594
- Inventors
- 4,024
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 6 | 0 |
| 1992 | 8 | 0 |
| 1993 | 6 | 0 |
| 1994 | 7 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 10 | 0 |
| 1998 | 13 | 0 |
| 1999 | 19 | 0 |
| 2000 | 26 | 0 |
| 2001 | 36 | 11 |
| 2002 | 32 | 44 |
| 2003 | 33 | 52 |
| 2004 | 40 | 37 |
| 2005 | 31 | 58 |
| 2006 | 45 | 63 |
| 2007 | 39 | 65 |
| 2008 | 31 | 89 |
| 2009 | 45 | 103 |
| 2010 | 67 | 93 |
| 2011 | 83 | 102 |
| 2012 | 78 | 114 |
| 2013 | 85 | 108 |
| 2014 | 99 | 128 |
| 2015 | 114 | 164 |
| 2016 | 116 | 157 |
| 2017 | 124 | 136 |
| 2018 | 117 | 124 |
| 2019 | 122 | 119 |
| 2020 | 146 | 186 |
| 2021 | 111 | 141 |
| 2022 | 107 | 136 |
| 2023 | 116 | 77 |
| 2024 | 100 | 78 |
| 2025 | 54 | 65 |
| 2026 | 42 | 46 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Package with solder mask1 Sep 2026US 12,727,487 B2NXP USA, Inc.
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- Semiconductor device and method for producing semiconductor device8 Oct 2026US 2026/0314503 A1Resonac Corporation
- Film adhesive, dicing/die attach film, semiconductor device, and production method for same24 Sep 2026US 2026/0293603 A1Resonac Corporation
- Underfill adhesive flow control using dam structure24 Sep 2026US 2026/0293738 A1QUALCOMM Incorporated
- Thermally conductive sheet and method for manufacturing same17 Sep 2026US 2026/0282904 A1Sekisui Chemical Co., Ltd.
Most cited
By later US patents
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- Methods and devices for fabricating and assembling printable semiconductor elements341US 8,440,546 B2The Board of Trustees of the University of Illinois · 2013