Thermally conductive sheet and method for manufacturing same
AssigneeSekisui Chemical Co., Ltd.
InventorsKenta KUROO, Kouji ASHIBA
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Abstract
A heat conductive sheet including a heat conductive layer including a polymer matrix and a heat conductive filler, and an acrylic pressure-sensitive adhesive layer provided on the surface of the heat conductive layer, wherein the acrylic pressure-sensitive adhesive layer has a reactive double bond.
Claims14
A heat conductive sheet comprising a heat conductive layer comprising a polymer matrix and a heat conductive filler, and an acrylic pressure-sensitive adhesive layer provided on a surface of the heat conductive layer,
- the acrylic pressure-sensitive adhesive layer comprising a reactive double bond.
A method for producing a heat conductive sheet, comprising the steps of:
- mixing at least a curable polymer composition and a heat conductive filler to obtain a mixed composition;
- curing the mixed composition by heating to obtain a cured product;
- and
- applying a pressure-sensitive adhesive to a surface of the cured product,
- the pressure-sensitive adhesive being an acrylic pressure-sensitive adhesive comprising a reactive double bond.
Use of a heat conductive sheet for adhering a semiconductor chip and a heat spreader in a reflow process, the heat conductive sheet comprising a heat conductive layer comprising a polymer matrix and a heat conductive filler, and an acrylic pressure-sensitive adhesive layer provided on a surface of the heat conductive layer,
- the acrylic pressure-sensitive adhesive layer comprising a reactive double bond.
Dependencies are inferred from the claim text.