H10W 72/07311
Treating the bonding area before connecting
Official title: {Treating the bonding area before connecting, e.g. by applying flux or cleaning}
H10W72/07311 (Treating the bonding area before connecting) appears on 819 US grants and 934 published applications in this corpus.
Search patents in H10W- Granted patents
- 819
- Published applications
- 934
- Assignees
- 341
- Inventors
- 1,879
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 4 | 0 |
| 1991 | 1 | 0 |
| 1992 | 4 | 0 |
| 1993 | 3 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 7 | 0 |
| 1999 | 10 | 0 |
| 2000 | 16 | 0 |
| 2001 | 15 | 6 |
| 2002 | 23 | 29 |
| 2003 | 19 | 25 |
| 2004 | 28 | 26 |
| 2005 | 18 | 40 |
| 2006 | 23 | 32 |
| 2007 | 28 | 36 |
| 2008 | 23 | 50 |
| 2009 | 20 | 52 |
| 2010 | 39 | 39 |
| 2011 | 37 | 31 |
| 2012 | 23 | 37 |
| 2013 | 33 | 23 |
| 2014 | 26 | 34 |
| 2015 | 24 | 32 |
| 2016 | 30 | 37 |
| 2017 | 34 | 56 |
| 2018 | 42 | 42 |
| 2019 | 34 | 37 |
| 2020 | 48 | 57 |
| 2021 | 35 | 45 |
| 2022 | 30 | 40 |
| 2023 | 43 | 42 |
| 2024 | 36 | 30 |
| 2025 | 25 | 34 |
| 2026 | 19 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Manufacturing method for semiconductor device8 Sep 2026US 12,733,528 B2Fuji Electric Co., Ltd.
- Adhesive bonding composition and method of use1 Sep 2026US 12,722,358 B2Immunolight, LLC
- Package with solder mask1 Sep 2026US 12,727,487 B2NXP USA, Inc.
- Energy augmentation structures for use with energy emitters and collectors11 Aug 2026US 12,702,861 B2Immunolight, LLC
- Heat dissipation in semiconductor devices28 Jul 2026US 12,696,763 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Heat dissipation in semiconductor devices8 Oct 2026US 2026/0314410 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuits with fusion-bonded diamond substrates for thermal management24 Sep 2026US 2026/0293674 A1Intel Corporation
- Underfill adhesive flow control using dam structure24 Sep 2026US 2026/0293738 A1QUALCOMM Incorporated
- Modification of ceramic capacitor for mitigation of delamination in memory devices30 Jul 2026US 2026/0221344 A1Micron Technology, Inc.
- Methods for low temperature bonding using nanoparticles30 Jul 2026US 2026/0223715 A1Adeia Semiconductor Technologies LLC
Most cited
By later US patents
- Nitride-enriched oxide-to-oxide 3D wafer bonding258US 9,496,239 B1International Business Machines Corporation · 2016
- Reduced stress plastic package256US 5,278,446 AMotorola, Inc. · 1994
- Method and structure for wafer to wafer bonding in semiconductor packaging237US 8,377,798 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013
- Three dimensional device integration method and integrated device220US 7,126,212 B2Ziptronix, Inc. · 2006
- Symmetrical package for semiconductor die208US 6,256,200 B12001