Reduced stress plastic package
AssigneeMotorola, Inc.
InventorsBenamanahalli K. Nagaraj, Timothy L. Olson, Udey Chaudhry
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Abstract
A plastic package (10) with a heat sink (11, 27, 28, 32) has a stress relief wall (18, 21, 33) formed on its upper surface. A semiconductor die (12) is mounted on the heat sink (11, 27, 28, 32) such that the top of a semiconductor die (12) is below the level of the top of the wall (18, 21, 33), and the wall (18, 21, 33) absorbs stresses which otherwise would be applied to the semiconductor die (12). The package (10) is simple to fabricate and assemble, and provides a mold lock (23, 24, 31) which serves to hold the plastic material (13) tightly to the heat sink (11, 27, 28, 32). Extra die bond material (26) can be used to increase heat flow without compromising other characteristics of the package (10).
Claims1
A reduced stress plastic package, comprising:
- a unitary heat sink having an upper surface;
- a mold lock formed on the upper surface of the unitary heat sink;
- a recessed die cavity of predetermined size and depth formed on the upper surface of the unitary heat sink;
- a semiconductor die mounted within the recessed die cavity by a die attach material which spills over into a void between the semiconductor die and the unitary heat sink, at least two thirds of the semiconductor die being lower than the upper surface of the unitary heat sink and wherein the recessed die cavity is formed to a depth which mounts the semiconductor die at a depth in the vicinity of the neutral stress axis of flexure for the reduced stress plastic package;
- a plurality of leads positioned above the semiconductor die which are electrically coupled to the semiconductor die by a plurality of bonding wires;
- and
- a plastic material which encapsulates the semiconductor die and the upper surface of the unitary heat sink.
Dependencies are inferred from the claim text.