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US 2026/0221344 A1Published application
Modification of ceramic capacitor for mitigation of delamination in memory devices
AssigneeMicron Technology, Inc.
InventorsYi-Yu Chen, Yung-Sheng Zou, Yi-Jing Chen, Min-Hua Chung, Chong Leong Gan
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Abstract
An apparatus includes a ceramic capacitor comprising a ceramic component and one or more metal components; and an encapsulation layer that encapsulates the ceramic capacitor from an external environment, wherein at least one surface of the ceramic component of the ceramic capacitor is finished to strengthen a bond capability between the at least one surface and the encapsulation layer.
Claims20
An apparatus, comprising:
- a ceramic capacitor comprising a ceramic component and one or more metal components;
- and
- an encapsulation layer that encapsulates the ceramic capacitor from an external environment, wherein at least one surface of the ceramic component of the ceramic capacitor is finished to strengthen a bond capability between the at least one surface and the encapsulation layer.
A system comprising:
- a substrate;
- and
- a memory device, coupled to the substrate, comprising:
- a ceramic capacitor comprising a ceramic component and one or more metal components;
- and
- an encapsulation layer that encapsulates the ceramic capacitor from an external environment, wherein at least one surface of the ceramic component of the ceramic capacitor is finished to strengthen a bond capability between the at least one surface and the encapsulation layer.
3 more elements
An apparatus, comprising:
- a substrate;
- a ceramic capacitor, wherein the ceramic capacitor is mounted on the substrate;
- and
- an encapsulation layer that encapsulates the ceramic capacitor from an external environment, wherein at least one surface of the ceramic component of the ceramic capacitor is finished to strengthen a bond capability between the at least one surface and the encapsulation layer.
1 more element
Dependencies are inferred from the claim text.