H10W 72/07321
Aligning
Official title: {Aligning}
H10W72/07321 (Aligning) appears on 1,170 US grants and 1,313 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,170
- Published applications
- 1,313
- Assignees
- 446
- Inventors
- 2,343
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 5 | 0 |
| 1997 | 5 | 0 |
| 1998 | 8 | 0 |
| 1999 | 10 | 0 |
| 2000 | 16 | 0 |
| 2001 | 18 | 8 |
| 2002 | 15 | 23 |
| 2003 | 15 | 24 |
| 2004 | 19 | 27 |
| 2005 | 17 | 41 |
| 2006 | 24 | 36 |
| 2007 | 25 | 52 |
| 2008 | 30 | 56 |
| 2009 | 31 | 44 |
| 2010 | 38 | 43 |
| 2011 | 47 | 44 |
| 2012 | 39 | 54 |
| 2013 | 44 | 46 |
| 2014 | 55 | 64 |
| 2015 | 54 | 81 |
| 2016 | 61 | 60 |
| 2017 | 51 | 68 |
| 2018 | 58 | 64 |
| 2019 | 62 | 57 |
| 2020 | 61 | 100 |
| 2021 | 78 | 94 |
| 2022 | 57 | 93 |
| 2023 | 82 | 60 |
| 2024 | 66 | 37 |
| 2025 | 49 | 26 |
| 2026 | 13 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- IC chip mounting device and IC chip mounting method29 Sep 2026US 12,751,255 B2Sato Holdings Kabushiki Kaisha/ Sato Corporation
- Opto-electronic apparatus and manufacturing method thereof8 Sep 2026US RE51,028 E1LG Display Co., Ltd.
- First chip and wafer bonding method and chip stacking structure18 Aug 2026US 12,713,934 B2Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Semiconductor package11 Aug 2026US 12,708,051 B2Samsung Electronics Co., Ltd.
- Selective transfer of micro devices14 Jul 2026US 12,684,691 B2VueReal Inc.
- Stacked semiconductor die assemblies with die support members and associated systems and methods1 Oct 2026US 2026/0305487 A1Micron Technology, Inc.
- Semiconductor module manufacturing device and semiconductor module manufacturing method10 Sep 2026US 2026/0271765 A1Rohm Co., Ltd.
- Apparatus configured to bond an electronic component23 Jul 2026US 2026/0215212 A1Micraft System Plus Co., Ltd.
- Method for bonding heat sink2 Jul 2026US 2026/0191022 A1Horng Terng Automation Co., Ltd.
- Die-bonding method that allows die-bonding device to adapt to angle of substrate2 Jul 2026US 2026/0191122 A1Saultech Technology Co., Ltd.
Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Method for fabricating self-assembling microstructures513US 5,545,291 AThe Regents of the University of California · 1996
- Methods and devices for fabricating and assembling printable semiconductor elements382US 7,982,296 B2The Board of Trustees of the University of Illinois · 2011
- Method of fabricating compliant interface for semiconductor chip367US 5,659,952 ATessera, Inc. · 1997