H10W 72/07323
Active alignment
Official title: {Active alignment, e.g. using optical alignment using marks or sensors}
H10W72/07323 (Active alignment) appears on 465 US grants and 530 published applications in this corpus.
Search patents in H10W- Granted patents
- 465
- Published applications
- 530
- Assignees
- 205
- Inventors
- 917
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 1 |
| 2005 | 1 | 6 |
| 2006 | 3 | 6 |
| 2007 | 8 | 8 |
| 2008 | 4 | 18 |
| 2009 | 5 | 13 |
| 2010 | 18 | 23 |
| 2011 | 19 | 19 |
| 2012 | 19 | 29 |
| 2013 | 24 | 18 |
| 2014 | 23 | 26 |
| 2015 | 27 | 40 |
| 2016 | 32 | 34 |
| 2017 | 28 | 36 |
| 2018 | 27 | 28 |
| 2019 | 36 | 31 |
| 2020 | 25 | 42 |
| 2021 | 35 | 42 |
| 2022 | 28 | 41 |
| 2023 | 40 | 33 |
| 2024 | 28 | 16 |
| 2025 | 26 | 14 |
| 2026 | 7 | 5 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- IC chip mounting device and IC chip mounting method29 Sep 2026US 12,751,255 B2Sato Holdings Kabushiki Kaisha/ Sato Corporation
- First chip and wafer bonding method and chip stacking structure18 Aug 2026US 12,713,934 B2Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Selective transfer of micro devices14 Jul 2026US 12,684,691 B2VueReal Inc.
- Method of forming wafer-to-wafer bonding structure10 Mar 2026US 12,575,464 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Manufacturing apparatus and manufacturing method of semiconductor device24 Feb 2026US 12,563,999 B2Yamaha Robotics Co., Ltd.
- Apparatus configured to bond an electronic component23 Jul 2026US 2026/0215212 A1Micraft System Plus Co., Ltd.
- Die-bonding method that allows die-bonding device to adapt to angle of substrate2 Jul 2026US 2026/0191122 A1Saultech Technology Co., Ltd.
- Panel level packaging for modular embedded devices25 Jun 2026US 2026/0181781 A1Semiconductor Components Industries, LLC
- Package structure and method of forming the same18 Jun 2026US 2026/0173895 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure and method of fabricating the same4 Jun 2026US 2026/0157233 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Methods and devices for fabricating and assembling printable semiconductor elements382US 7,982,296 B2The Board of Trustees of the University of Illinois · 2011
- Methods and devices for fabricating and assembling printable semiconductor elements341US 8,440,546 B2The Board of Trustees of the University of Illinois · 2013
- Methods and devices for fabricating and assembling printable semiconductor elements327US 8,664,699 B2The Board of Trustees of the University of Illinois · 2014