US 2026/0215212 A1Published application

Apparatus configured to bond an electronic component

AssigneeMicraft System Plus Co., Ltd.

InventorsSheng Che Huang, Chingju Lin

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Abstract

An apparatus configured to bond an electronic component includes a bonding mechanism, a carrying platform, a confirming-image capturing mechanism, a positioning-image capturing mechanism, an energy generating mechanism, and a control unit. The bonding mechanism includes a bonding head having a reference mark and a positioning mark and grabbing an electronic component to be bonded to be placed at a desired bonding position. The carrying platform is configured to carry a substrate to be bonded. The carrying platform and the bonding head are oppositely disposed. The confirming-image capturing mechanism captures an image between the reference mark and the electronic component. The positioning-image capturing mechanism captures an image of a part of the substrate through the positioning mark. The energy generating mechanism provides energy to the bonding head. The control unit instructs the bonding head and/or the carrying platform to actuate and complete bonding according to information from the confirming-image capturing mechanism.

Claims18

Dependent claims

An apparatus configured to bond an electronic component, comprising:

a bonding mechanism, having a bonding head, wherein the bonding mechanism grabs an electronic component to be bonded by the bonding head, and place the electronic component to be bonded at a desired bonding position to perform bonding, wherein a reference mark and a positioning mark are provided on the bonding head;
a carrying platform, configured to carry a substrate to be bonded, wherein the carrying platform and the bonding head of the bonding mechanism are disposed opposite to each other;
a confirming-image capturing mechanism, capturing an image between the reference mark on the bonding head and the electronic component to be bonded grabbed by the bonding head;
a positioning-image capturing mechanism, capturing an image of the substrate to be bonded carried by a part of the carrying platform through the positioning mark on the bonding head;
an energy generating mechanism, providing an energy to the bonding head of the bonding mechanism to perform bonding;
and
a control unit, instructing the bonding head and/or the carrying platform to actuate according to information from the confirming-image capturing mechanism, and enabling the bonding head to complete actuation of bonding.

4 more elements

Dependencies are inferred from the claim text.