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US 2026/0157233 A1Published application
Package structure and method of fabricating the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMing-Fa Chen, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih
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Abstract
A structure including stacked substrates, a first semiconductor die, a second semiconductor die, and an insulating encapsulation is provided. The first semiconductor die is disposed over the stacked substrates. The second semiconductor die is stacked over the first semiconductor die. The insulating encapsulation includes a first encapsulation portion encapsulating the first semiconductor die and a second encapsulation portion encapsulating the second semiconductor die.
Claims20
A structure, comprising:
- a first semiconductor die laterally encapsulated by a first encapsulation portion;
- a support substrate;
- a bonding structure covering the first semiconductor die and the first encapsulation portion, wherein the bonding structure and the support substrate are disposed at opposite sides of the first semiconductor die;
- and
- a second semiconductor die laterally encapsulated by a second encapsulation portion, wherein the first encapsulation portion is spaced apart from the second encapsulation portion by the bonding structure.
2 more elements
A structure, comprising:
- a support substrate;
- a first semiconductor die laterally encapsulated by a first encapsulation portion;
- a bonding layer disposed between the first semiconductor die and the support substrate as well as between the first encapsulation portion and the support substrate;
- a bonding structure covering the first semiconductor die and the first encapsulation portion;
- a second semiconductor die disposed on the bonding structure and electrically connected to the first semiconductor die through the bonding structure.
2 more elements
A method, comprising:
- laterally encapsulating a first semiconductor die with a first encapsulation portion;
- providing a support substrate and bonding the first semiconductor die and the first encapsulation portion with the support substrate;
- forming a bonding structure on the first semiconductor die and the first encapsulation portion carried by the support substrate;
- electrically connecting a second semiconductor die to the first semiconductor die through the bonding structure;
- and
- forming a second encapsulation portion on the bonding structure to laterally encapsulate the second semiconductor die.
3 more elements
Dependencies are inferred from the claim text.