H10W 72/07327
Involving guiding structures
Official title: {involving guiding structures, e.g. spacers or supporting members}
H10W72/07327 (Involving guiding structures) appears on 665 US grants and 711 published applications in this corpus.
Search patents in H10W- Granted patents
- 665
- Published applications
- 711
- Assignees
- 275
- Inventors
- 1,382
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 5 | 0 |
| 1997 | 5 | 0 |
| 1998 | 8 | 0 |
| 1999 | 10 | 0 |
| 2000 | 16 | 0 |
| 2001 | 17 | 8 |
| 2002 | 15 | 23 |
| 2003 | 15 | 22 |
| 2004 | 17 | 25 |
| 2005 | 17 | 34 |
| 2006 | 21 | 31 |
| 2007 | 18 | 43 |
| 2008 | 27 | 39 |
| 2009 | 27 | 30 |
| 2010 | 24 | 21 |
| 2011 | 29 | 21 |
| 2012 | 21 | 22 |
| 2013 | 18 | 25 |
| 2014 | 31 | 40 |
| 2015 | 31 | 32 |
| 2016 | 28 | 22 |
| 2017 | 15 | 24 |
| 2018 | 23 | 26 |
| 2019 | 15 | 21 |
| 2020 | 28 | 42 |
| 2021 | 35 | 52 |
| 2022 | 26 | 48 |
| 2023 | 40 | 26 |
| 2024 | 38 | 19 |
| 2025 | 24 | 9 |
| 2026 | 6 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Opto-electronic apparatus and manufacturing method thereof8 Sep 2026US RE51,028 E1LG Display Co., Ltd.
- Semiconductor package11 Aug 2026US 12,708,051 B2Samsung Electronics Co., Ltd.
- Selective transfer of micro devices14 Jul 2026US 12,684,691 B2VueReal Inc.
- Stacked semiconductor die assemblies with die support members and associated systems and methods16 Jun 2026US 12,660,716 B2Micron Technology, Inc.
- Heterogeneous chip integration of III-nitride-based materials for optoelectronic device arrays in the visible and ultraviolet12 May 2026US 12,628,467 B2The Board of Trustees of the University of Illinois
- Stacked semiconductor die assemblies with die support members and associated systems and methods1 Oct 2026US 2026/0305487 A1Micron Technology, Inc.
- Semiconductor module manufacturing device and semiconductor module manufacturing method10 Sep 2026US 2026/0271765 A1Rohm Co., Ltd.
- Method for bonding heat sink2 Jul 2026US 2026/0191022 A1Horng Terng Automation Co., Ltd.
- Mechanical wafer alignment detection for bonding process9 Apr 2026US 2026/0101713 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Wafer-to-wafer bonding structure and fabrication method thereof19 Feb 2026US 2026/0052995 A1United Microelectronics Corp.
Most cited
By later US patents
- Method for fabricating self-assembling microstructures513US 5,545,291 AThe Regents of the University of California · 1996
- Method of fabricating compliant interface for semiconductor chip367US 5,659,952 ATessera, Inc. · 1997
- Apparatus for fabricating self-assembling microstructures356US 5,904,545 AThe Regents of the University of California · 1999
- Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices266US 6,326,698 B1Micron Technology, Inc. · 2001
- Method and apparatus for fabricating self-assembling microstructures258US 5,824,186 AThe Regents of the University of California · 1998