US 2026/0101713 A1 · MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS

Abstract

Various embodiments of the present disclosure are directed towards a method. The method includes providing a first semiconductor workpiece and a second semiconductor workpiece onto a platform. A plurality of positioning structures move the second semiconductor workpiece over the first semiconductor workpiece while moving from a plurality of reference positions to a plurality of first positions. A bonding apparatus is operated to bond the second semiconductor workpiece to the first semiconductor workpiece. The positioning structures are moved from the plurality of reference positions to a plurality of second positions. The positioning structures physically contact an outer perimeter of the first semiconductor workpiece and/or an outer perimeter of the second semiconductor workpiece while at the plurality of second positions. A shift value is determined between the first semiconductor workpiece and the second semiconductor workpiece based on a comparison between the plurality of first positions and the plurality of second positions.

Claims20

Dependent claims

A method, comprising:

providing a first semiconductor workpiece onto a platform;
providing a second semiconductor workpiece over the first semiconductor workpiece;
moving a plurality of positioning structures from a plurality of reference positions to a plurality of first positions, the plurality of positioning structures moving the second semiconductor workpiece over the first semiconductor workpiece while moving from the reference positions to the first positions;
operating a bonding apparatus to bond the second semiconductor workpiece to the first semiconductor workpiece;
moving the plurality of positioning structures from the plurality of reference positions to a plurality of second positions, the plurality of positioning structures physically contacting an outer perimeter of the first semiconductor workpiece and/or an outer perimeter of the second semiconductor workpiece while at the plurality of second positions;
and
determining a shift value between the first semiconductor workpiece and the second semiconductor workpiece based on a comparison between the plurality of first positions and the plurality of second positions.

4 more elements

A method, comprising:

loading a first semiconductor workpiece and a second semiconductor workpiece on a platform;
performing an alignment process to align the second semiconductor workpiece over the first semiconductor workpiece by way of a plurality of positioning structures that move independently of a movement of the second semiconductor workpiece and are external to the first and second semiconductor workpieces, wherein a vertical surface of one or more of the positioning structures physically contact one or more vertical surfaces of the first and second semiconductor workpieces during the alignment process, wherein the plurality of positioning structures generate first positional measurement data during the alignment process;
bonding the first and second semiconductor workpieces together;
and
performing an offset detection process on the first and second semiconductor workpieces by way of the plurality of positioning structures, wherein the plurality of positioning structures generate second positional measurement data during the offset detection process, wherein the second positional measurement data is different from the first positional measurement data.

2 more elements

Dependencies are inferred from the claim text.

Mechanical wafer alignment detection for bonding process

Life of this patent

Mechanical wafer alignment detection for bonding process

Life of this patent

Abstract

Claims20