Wafer-to-wafer bonding structure and fabrication method thereof
AssigneeUnited Microelectronics Corp.
InventorsYao-Hsien Chung, Fu-Yu Tsai, Bin-Siang Tsai
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Abstract
A wafer-to-wafer bonding structure includes a first wafer having a first bonding layer thereon, a first main pattern region, a first scribe lane surrounding the first main pattern region, and a first alignment cavity disposed in the first bonding layer within the first main pattern region; and a second wafer having a second bonding layer bonded to the first bonding layer, a second main pattern region, a second scribe lane surrounding the second main pattern region, and a second alignment cavity disposed in the second bonding layer within the second main pattern region.
Claims20
A wafer-to-wafer bonding structure, comprising:
- a first wafer having a first bonding layer thereon, a first main pattern region, a first scribe lane surrounding the first main pattern region, and a first alignment cavity disposed in the first bonding layer within the first main pattern region;
- and
- a second wafer having a second bonding layer bonded to the first bonding layer, a second main pattern region, a second scribe lane surrounding the second main pattern region, and a second alignment cavity disposed in the second bonding layer within the second main pattern region.
A method for forming a wafer-to-wafer bonding structure, comprising:
- providing a first wafer having a first bonding layer thereon, a first main pattern region, a first scribe lane surrounding the first main pattern region, and a first alignment cavity disposed in the first bonding layer within the first main pattern region;
- providing a second wafer having a second bonding layer, a second main pattern region, a second scribe lane surrounding the second main pattern region, and a second alignment cavity disposed in the second bonding layer within the second main pattern region;
- aligning the first wafer with the second wafer by scanning the first alignment cavity and the second alignment cavity, respectively;
- and
- bonding the first bonding layer of the first wafer to the second bonding layer of the second wafer, thereby forming the wafer-to-wafer bonding structure.
Dependencies are inferred from the claim text.