Method and apparatus for fabricating self-assembling microstructures
AssigneeThe Regents of the University of California
InventorsJohn Stephen Smith, Hsi-Jen J. Yeh
Life of this patent
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Abstract
A method and apparatus for assembling microstructures onto a substrate through fluid transport. The microstructures being shaped blocks self-align into recessed regions located on a substrate such that the microstructure becomes integral with the substrate. The improved method includes a step of transferring the shaped blocks into a fluid to create a slurry. Such slurry is then dispensed evenly or circulated over the top surface of a substrate having recessed regions thereon. The microstructure via the shape and fluid tumbles onto the surface of the substrate, self-aligns, and engages into a recessed region.
Claims28
A method of assembling a microstructure on a substrate, said substrate comprising a top surface with at least one recessed region thereon, comprising the steps of:
- providing a plurality of shaped blocks in a fluid to form a slurry;
- and
- circulating said slurry over said substrate at a rate where at least one of said shaped blocks is disposed at a selected orientation into said recessed region, each of said shaped blocks comprising a tapered edge to fit into said recessed region at said selected orientation.
A method of transporting a micromachined block comprising an integrated circuit portion, said method comprising:
- placing at least one block in a fluid;
- and transporting said block to a selected location.
A method of forming a hybrid integrated circuit comprising steps of:
- providing a first tapered shaped block including a first electronic device portion thereon, and a second electronic device portion;
- placing said first tapered shaped block into a first recessed region of a substrate;
- and
- interconnecting said first tapered shaped block with said, second electronic device portion, said interconnecting step being a metallization step.
A method of assembling a microstructure on a substrate, said substrate comprising a top surface with at least one recessed region thereon, comprising the steps of:
- providing a slurry comprising a plurality of tapered blocks and a fluid, said shaped block including at least a portion of an integrated circuit;
- and
- transferring said slurry over said substrate at a rate where at least one of said shaped blocks is dispensed into a recessed region.
Dependencies are inferred from the claim text.