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US 12,660,716 B2Granted
Stacked semiconductor die assemblies with die support members and associated systems and methods
AssigneeMicron Technology, Inc.
InventorsSeng Kim Ye, Hong Wan Ng
Life of this patent
Estimating the term…
Abstract
Stacked semiconductor die assemblies with die support members and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a package substrate, a first semiconductor die attached to the package substrate, and a support member attached to the package substrate. The support member can be separated from the first semiconductor die, and a second semiconductor die can have one region coupled to the support member and another region coupled to the first semiconductor die.
Claims20
A semiconductor die assembly, comprising:
- a package substrate;
- a first elongate support member on the package substrate having a first length greater than a first width;
- a second elongate support member on the package substrate having a second length greater than a second width, wherein the second length is generally perpendicular to the first length;
- a controller die on the package substrate and spaced laterally apart from the first and second elongate support members;
- and
- a memory die mounted to the first and second elongate support members and the controller die,
- wherein the controller die is partially, but not completely, superimposed within a footprint of the memory die.
4 more elements
A semiconductor die assembly, comprising:
- a package substrate including a first plurality of bond pads;
- a first elongate support member mounted to the package substrate by a first die attach material, the first elongate support member having a first length greater than a first width;
- a second elongate support member mounted to the package substrate by a second die attach material, the second elongate support member having a second length greater than a second width, wherein the second length is generally perpendicular to the first length;
- a controller die on the package substrate and spaced laterally apart from the first and second support members, wherein the controller die includes a second plurality of bond pads electrically coupled to the package substrate;
- a first memory die mounted to the first and second support members and the controller die by a third die attach material, the first memory die including a third plurality of bond pads;
- a second memory die mounted to the first memory die by a fourth die attach material, the second memory die including a fourth plurality of bond pads;
- and
- a plurality of wire bonds coupling bond pads of the first plurality of bond pads to bond pads of the second and third pluralities of bond pads;
- wherein the controller die is partially, but not completely, superimposed within a footprint of either the first or the second memory die such that a first bond pad from the second plurality of bond pads is positioned within the footprint of either the first or the second memory die and a second bond pad from the second plurality of bond pads is positioned outside the footprint of either the first or the second memory die.
6 more elements
Dependencies are inferred from the claim text.