Method for fabricating self-assembling microstructures
AssigneeThe Regents of the University of California
InventorsJohn S. Smith, Hsi-Jen J. Yeh
Life of this patent
Estimating the term…
Abstract
A method for assembling microstructures onto a substrate through fluid transport. The microstructures being shaped blocks self-align into recessed regions located on a substrate such that the microstructure becomes integral with the substrate 20, 70, 90, 120, 200. The improved method includes a step of transferring the shaped blocks into a fluid to create a slurry. Such slurry is then poured evenly over the top surface of a substrate having recessed regions thereon. The microstructure via the shape and fluid tumbles onto the surface of the substrate, self-aligns, and engages into a recessed region.
Claims26
A method of assembling a microstructure on a substrate, said substrate comprising a top surface with at least one recessed region thereon, comprising the steps of:
- providing a plurality of shaped blocks, said shaped block comprising an integrated circuit device thereon;
- transferring said shaped blocks into a fluid to form a slurry;
- and
- dispensing said slurry over said substrate at a rate where at least one of said shaped blocks is disposed into a recessed region.
A method of fabricating shaped blocks comprising an integrated circuit device, comprising the steps of:
- providing a substrate having a top surface and a backside;
- growing a sacrificial layer made from a material selected from the group consisting of aluminum arsenide, indium phosphate and silicon dioxide overlying said top surface;
- forming a block layer overlying said top surface;
- and
- masking and etching said block layer up to said sacrificial layer forming a plurality of shaped blocks on and in contact with said sacrificial layer.
A method of fabricating shaped blocks comprising an integrated circuit device, comprising the steps of:
- providing a substrate having a top surface and a backside;
- growing a sacrificial layer overlying said top surface;
- forming a block layer overlying said top surface;
- and
- masking and etching said block layer up to said sacrificial layer forming a plurality of shaped blocks on and in contact with said sacrificial layer;
- depositing a filler layer onto a top surface of said shaped blocks and exposed portions of said sacrificial layer;
- attaching a top surface of an intermediate substrate onto said top surface of said shaped blocks;
- removing said substrate from said shaped blocks;
- processing portions of said shaped blocks, said processing step forming integrated circuit devices on said blocks;
- and removing said filler layer and said shaped blocks from said intermediate substrate.
A method of fabricating shaped blocks comprising an integrated circuit device, comprising:
- providing a substrate including a release layer overlying the substrate, and a block layer overlying the release layer;
- patterning said block layer to form a plurality of shaped blocks;
- preferential etching said release layer to release said plurality of shaped blocks.
Dependencies are inferred from the claim text.