H10W 72/076
Of strap connectors
Official title: {of strap connectors}
H10W72/076 (Of strap connectors) appears on 1,808 US grants and 2,212 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,808
- Published applications
- 2,212
- Assignees
- 378
- Inventors
- 2,763
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 6 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 5 | 0 |
| 1999 | 2 | 0 |
| 2000 | 5 | 0 |
| 2001 | 8 | 6 |
| 2002 | 12 | 28 |
| 2003 | 27 | 19 |
| 2004 | 20 | 36 |
| 2005 | 21 | 40 |
| 2006 | 33 | 63 |
| 2007 | 30 | 91 |
| 2008 | 37 | 70 |
| 2009 | 49 | 74 |
| 2010 | 69 | 71 |
| 2011 | 65 | 84 |
| 2012 | 73 | 110 |
| 2013 | 101 | 112 |
| 2014 | 92 | 121 |
| 2015 | 127 | 136 |
| 2016 | 119 | 121 |
| 2017 | 107 | 107 |
| 2018 | 92 | 104 |
| 2019 | 99 | 99 |
| 2020 | 78 | 114 |
| 2021 | 109 | 151 |
| 2022 | 96 | 120 |
| 2023 | 91 | 103 |
| 2024 | 96 | 101 |
| 2025 | 71 | 86 |
| 2026 | 39 | 45 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method of making a multi-chip package device6 Oct 2026US 12,757,800 B2Force Mos Technology Co., Ltd.
- Semiconductor device and method for manufacturing semiconductor device15 Sep 2026US 12,740,458 B2Mitsubishi Electric Corporation
- Chip package with contact clip8 Sep 2026US 12,730,135 B2Infineon Technologies AG
- Apparatus for bonding clip, method of bonding clip, and semiconductor package including semiconductor chip to which clip is bonded using the method8 Sep 2026US 12,733,527 B2JMJ Korea Co., Ltd.
- Power semiconductor device attached to a lead frame18 Aug 2026US 12,713,940 B2Nexperia B. V.
- Isolated metal clips with structural bridge8 Oct 2026US 2026/0314452 A1Analog Devices, Inc.
- Method of manufacturing a plurality of semiconductor devices as well as a corresponding semiconductor device24 Sep 2026US 2026/0293703 A1Nexperia B. V.
- Power semiconductor package including stacked contact clips, system and method for fabricating a power semiconductor package10 Sep 2026US 2026/0271768 A1Infineon Technologies AG
- Monolithic spring assemblies for high-frequency press-pack modules20 Aug 2026US 2026/0248017 A1
- Semiconductor package having dual transistors and method of making the same6 Aug 2026US 2026/0231820 A1Alpha and Omega Semiconductor International LP
Most cited
By later US patents
- Semiconductor device including cladded base plate274US 8,963,321 B2Infineon Technologies AG · 2015
- Self-centering electrode for power devices249US 4,935,803 AMotorola, Inc. · 1990
- Semiconductor package243US 6,040,626 AInternational Rectifier Corporation · 2000
- Symmetrical package for semiconductor die208US 6,256,200 B12001
- Mold-type semiconductor device207US 5,218,231 AKabushiki Kaisha Toshiba · 1993