H10W 72/07611
Treating the bonding area before connecting
Official title: {Treating the bonding area before connecting, e.g. by applying flux or cleaning}
H10W72/07611 (Treating the bonding area before connecting) appears on 22 US grants and 30 published applications in this corpus.
Search patents in H10W- Granted patents
- 22
- Published applications
- 30
- Assignees
- 15
- Inventors
- 61
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2012 | 0 | 1 |
| 2013 | 1 | 2 |
| 2014 | 0 | 1 |
| 2015 | 1 | 0 |
| 2016 | 1 | 1 |
| 2017 | 2 | 4 |
| 2018 | 1 | 1 |
| 2019 | 3 | 1 |
| 2020 | 2 | 3 |
| 2021 | 2 | 2 |
| 2022 | 3 | 3 |
| 2023 | 1 | 3 |
| 2024 | 0 | 3 |
| 2025 | 3 | 4 |
| 2026 | 2 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Apparatus for bonding clip, method of bonding clip, and semiconductor package including semiconductor chip to which clip is bonded using the method8 Sep 2026US 12,733,527 B2JMJ Korea Co., Ltd.
- Roughened surface of a conductive wedge bonded ribbon encapsulated in a sermiconductor package10 Mar 2026US 12,575,468 B2STMicroelectronics S,r.l.
- Flex bonded integrated circuits7 Oct 2025US 12,438,114 B2Meta Platforms, Inc.
- Connecting strip for discrete and power electronic devices29 Jul 2025US 12,374,648 B2STMicroelectronics S,r.l.
- Semiconductor package with wire bond joints21 Jan 2025US 12,205,874 B2Infineon Technologies AG
- Transistor chip package with bent clip19 Mar 2026US 2026/0082939 A1
- Connecting strip for discrete and power electronic devices16 Oct 2025US 2025/0323205 A1STMicroelectronics S,r.l.
- Method of manufacturing semiconductor devices and corresponding device10 Apr 2025US 2025/0118703 A1STMicroelectronics International N. V.
- Power module structure with clip substrate member27 Mar 2025US 2025/0105200 A1Semiconductor Components Industries, LLC
- Dual switching power device27 Feb 2025US 2025/0070101 A1
Most cited
By later US patents
- IGBT power semiconductor package having a conductive clip7US 8,354,733 B2International Rectifier Corporation · 2013
- Semiconductor device and method of manufacturing the same2US 9,337,129 B2Rohm Co., Ltd. · 2016
- Semiconductor device including a clip2US 9,640,465 B2Infineon Technologies AG · 2017
- Topside-cooled semiconductor package with molded standoff1US 11,239,127 B2Infineon Technologies AG · 2022
- Power semiconductor package with conductive clip1US 9,118,126 B2International Rectifier Corporation · 2015