Roughened surface of a conductive wedge bonded ribbon encapsulated in a sermiconductor package
AssigneeSTMicroelectronics S.r.l.
InventorsMatteo De Santa, Mauro Mazzola
Life of this patent
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Abstract
A semiconductor die and an electrically conductive ribbon are arranged on a substrate. The electrically conductive ribbon includes a roughened surface. An insulating encapsulation is molded onto the semiconductor die and the electrically conductive ribbon. The roughened surface of the electrically conductive ribbon provides a roughened coupling interface to the insulating encapsulation.
Claims18
A method, comprising:
- arranging at least one semiconductor die and at least one electrically conductive ribbon on a substrate, the at least one electrically conductive ribbon being wedge bonded to the at least one semiconductor die and providing a current flow path for the at least one semiconductor die;
- wherein the at least one electrically conductive ribbon comprises a roughened surface;
- and
- molding an insulating encapsulation onto the at least one semiconductor die and the at least one electrically conductive ribbon, wherein the insulating encapsulation encapsulates the at least one semiconductor die and the at least one electrically conductive ribbon, and wherein the roughened surface provides a roughened coupling interface to said insulating encapsulation.
A device, comprising:
- a substrate;
- at least one semiconductor die and at least one electrically conductive ribbon arranged on the substrate, the at least one electrically conductive ribbon being wedge bonded to the at least one semiconductor die and providing a current flow path for the at least one semiconductor die;
- wherein the at least one electrically conductive ribbon comprises a roughened surface;
- and
- an insulating encapsulation molded onto the at least one semiconductor die and the at least one electrically conductive ribbon;
- wherein the insulating encapsulation encapsulates the at least one semiconductor die and the at least one electrically conductive ribbon;
- and
- wherein the roughened surface provides a roughened coupling interface to said insulating encapsulation.
An electrically conductive ribbon configured to provide a current flow path for at least one semiconductor die arranged on a substrate, wherein the at least one electrically conductive ribbon is configured for wedge bonding to the at least one semiconductor die and comprises a roughened surface configured to provide a roughened coupling interface to an insulating encapsulation molded onto the substrate having the at least one semiconductor die and the at least one electrically conductive ribbon arranged thereon.
Dependencies are inferred from the claim text.