Power module structure with clip substrate member

A power module comprising:

• a substrate including a first conductive layer, a second conductive layer, and a dielectric layer disposed between the first conductive layer and the second conductive layer;
• a plurality of semiconductor dies coupled to the first conductive layer of the substrate;
• and
• a clip substrate member including a first conductive clip coupled to the plurality of semiconductor dies, a second conductive clip coupled to the plurality of semiconductor dies, and a dielectric material having a portion disposed between the first conductive clip and the second conductive clip,
• the clip substrate member including a source contact region, the source contact region including a first portion of a surface of the clip substrate member, the source contact region including a portion of the first conductive clip.

A method of assembling a power module, the method comprising;

• assembling a clip substrate member, the clip substrate member including a first conductive clip, a second conductive clip, and a dielectric material having a portion disposed between the first conductive clip and the second conductive clip, the clip substrate member including a first surface and a second surface;
• coupling a plurality of semiconductor dies to a conductive layer of a substrate;
• and
• coupling the clip substrate member to the plurality of semiconductor dies such that the plurality of semiconductor dies is coupled to the first conductive clip and the second conductive clip.