Transistor chip package with bent clip

A method of manufacturing a transistor package, the method comprising:

• placing a transistor chip on a carrier, the transistor chip having a first load electrode and a second load electrode on a first main side of the transistor chip, the carrier facing a second main side of the transistor chip opposite the first main side;
• arranging a first terminal post laterally beside the transistor chip;
• arranging a second terminal post laterally beside the transistor chip on an opposite side of the transistor chip;
• providing a first clip and a second clip;
• bending a first contact element of at least one of the first clip and the second clip downwards, so that a bending section of the first contact element is formed;
• placing the first clip to connect between the first load electrode and the first terminal post;
• and
• placing the second clip to connect between the second load electrode and the second terminal post,
• wherein the first contact element projects from a first side wall of the at least one of the first clip and the second clip and bends downwards in a direction towards the transistor chip to electrically contact the first load electrode or the second load electrode of the transistor chip, a bending axis being in a longitudinal direction of the at least one of the first clip and the second clip.