Dual switching power device

An electronic device, comprising:

• a package structure having opposite longitudinal ends spaced apart from one another along a first direction, and opposite lateral sides spaced apart from one another along a second direction that is orthogonal to the first direction;
• conductive leads partially exposed outside the respective lateral sides of the package structure;
• a semiconductor die having an electronic component;
• and
• a metal clip electrically coupled to the electronic component and exposed outside a first one of the longitudinal ends.

A system, comprising:

• a circuit board;
• and
• an electronic device attached to the circuit board and comprising:
• a package structure having opposite longitudinal ends spaced apart from one another along a first direction, opposite lateral sides spaced apart from one another along a second direction that is orthogonal to the first direction, a middle portion midway between the longitudinal ends, a first portion that extends between the middle portion and one of the longitudinal ends, and a second portion that extends between the middle portion and the other one of the longitudinal ends;
• conductive leads partially exposed outside the respective lateral sides of the package structure and soldered to conductive features of the circuit board;
• first and second semiconductor dies having respective first and second electronic components;
• and
• a metal clip that extends in the package structure from the first portion to the second portion through the middle portion and electrically couples the first electronic component of the first semiconductor die to the second electronic component of the second semiconductor die.

A method of fabricating an electronic device, the method comprising:

• attaching a first semiconductor die to a first die attach pad in a first row of a column of a lead frame panel array;
• attaching a second semiconductor die to a second die attach pad in an adjacent second row of the column of the lead frame panel array;
• attaching a metal clip to the first and second semiconductor dies with the metal clip extending in the first and second rows;
• forming a package structure that extends along the column and encloses the first and second semiconductor dies and the metal clip;
• trimming conductive leads along longitudinal sides of the column of the lead frame panel array;
• and
• separating the electronic device from the lead frame panel array.