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US 12,730,135 B2Granted
Chip package with contact clip
AssigneeInfineon Technologies AG
InventorHorst Theuss
Life of this patent
Estimating the term…
Abstract
According to an exemplary embodiment, a semiconductor component includes a chip carrier, a semiconductor chip mounted on the chip carrier, and a chip package made of potting compound. The potting compound only partially surrounds the semiconductor chip, such that at least part of an upper side of the semiconductor chip is not covered by the potting compound. The semiconductor component further includes a clip that is mechanically connected to the upper side of the semiconductor chip.
Claims14
A semiconductor component, comprising:
- a chip carrier;
- a semiconductor chip mounted on the chip carrier;
- a chip package made of potting compound that only partially surrounds the semiconductor chip, such that at least part of an upper side of the semiconductor chip is not covered by the potting compound;
- and
- a clip mechanically connected to the upper side of the semiconductor chip,
- wherein the clip and the chip package are mechanically connected via a plug-in or snap-fit connection.
3 more elements
A semiconductor component, comprising:
- a chip carrier;
- a semiconductor chip mounted on the chip carrier;
- a chip package made of potting compound that only partially surrounds the semiconductor chip, such that at least part of an upper side of the semiconductor chip is not covered by the potting compound;
- and
- a clip mechanically connected to the upper side of the semiconductor chip,
- wherein the clip and the chip package have corresponding geometries that define a relative position of the clip with respect to the chip package when the clip rests against the chip package.
3 more elements
A semiconductor component, comprising:
- a chip carrier;
- a semiconductor chip mounted on the chip carrier;
- a chip package made of potting compound that only partially surrounds the semiconductor chip, such that at least part of an upper side of the semiconductor chip is not covered by the potting compound;
- a clip mechanically connected to the upper side of the semiconductor chip;
- and
- a further semiconductor chip mounted on the chip carrier,
- wherein the clip is connected to a chip metallization of the semiconductor chip and a chip metallization of the further semiconductor chip.
4 more elements
Dependencies are inferred from the claim text.