H10W 72/07602
Using an auxiliary member
Official title: {using an auxiliary member}
H10W72/07602 (Using an auxiliary member) appears on 34 US grants and 47 published applications in this corpus.
Search patents in H10W- Granted patents
- 34
- Published applications
- 47
- Assignees
- 34
- Inventors
- 128
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 1 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 1 |
| 2015 | 1 | 2 |
| 2016 | 1 | 0 |
| 2017 | 1 | 5 |
| 2018 | 4 | 5 |
| 2019 | 1 | 1 |
| 2020 | 1 | 6 |
| 2021 | 6 | 6 |
| 2022 | 6 | 7 |
| 2023 | 3 | 2 |
| 2024 | 2 | 4 |
| 2025 | 4 | 6 |
| 2026 | 3 | 0 |
By publication year. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor device and method for manufacturing semiconductor device15 Sep 2026US 12,740,458 B2Mitsubishi Electric Corporation
- Clip interconnect with micro contact heads2 Jun 2026US 12,648,455 B2Semiconductor Components Industries, LLC
- Semiconductor device and method of forming clip bond having multiple bond line thicknesses13 Jan 2026US 12,525,567 B2UTAC Headquarters Pte. Ltd.
- Semiconductor devices having exposed clip top sides and methods of manufacturing semiconductor devices16 Sep 2025US 12,418,135 B2Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor device and method of forming leadframe with clip bond for electrical interconnect6 May 2025US 12,293,972 B2UTAC Headquarters Pte. Ltd.
- Semiconductor devices and methods of manufacturing semiconductor devices4 Dec 2025US 2025/0372914 A1Amkor Technology Singapore Holding Pte.Ltd.
- Method of forming a die package and die package2 Oct 2025US 2025/0308942 A1Infineon Technologies AG
- Semiconductor device and method of manufacturing the same17 Jul 2025US 2025/0233107 A1Fuji Electric Co., Ltd.
- Semiconductor device and methods of manufacturing semiconductor devices12 Jun 2025US 2025/0192093 A1Amkor Technology Singapore Holding Pte.Ltd.
- Method of manufacturing semiconductor devices and corresponding device10 Apr 2025US 2025/0118703 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Methods of packaging a semiconductor die and package formed by the methods36US 8,183,682 B2NXP B. V. · 2012
- Multi-chip module clips with connector bar6US 9,935,041 B1Texas Instruments Incorporated · 2018
- Molding material and method for packaging semiconductor chips4US 9,209,152 B2Infineon Technologies AG · 2015
- Semiconductor device1US 10,103,090 B2Denso Corporation · 2018
- Semiconductor package structure1US 10,672,677 B2Industrial Technology Research Institute · 2020