Methods of packaging a semiconductor die and package formed by the methods
AssigneeNXP B.V.
InventorsPaul Dijkstra, Roelf Anco Jacob Groenhuis
Life of this patent
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Abstract
A method of packaging a semiconductor die. The method comprises mounting a semiconductor die to a die attach pad on a carrier and electrically coupling an electrode of the semiconductor die and a contact pad on the carrier with a clip carried by a sacrificial substrate. The method further comprises removing the sacrificial substrate to release the clip. The method may be extended to accommodate a carrier having multiple device regions each with a die attach pad and a contact pad for mounting multiple semiconductor die.
Claims25
A method of packaging a semiconductor die, comprising:
- mounting a semiconductor die to a die attach pad on a carrier;
- after mounting the die to the die attach pad, positioning a sacrificial substrate adjacent the die and the carrier, and electrically coupling a first portion of a first clip carried by the sacrificial substrate with a first electrode of the semiconductor die, and electrically coupling a second portion of the first clip with a first contact pad on the carrier that is adjacent the die attach pad, the first electrode being on a surface of the semiconductor die that is opposite a surface of the semiconductor die directly coupled to the die attach pad;
- and
- after respectively coupling the first and second portions of the first clip, removing the sacrificial substrate from the first clip.
A method of packaging a plurality of semiconductor die, comprising:
- mounting each of the semiconductor die to a die attach pad of a corresponding one of a plurality of device regions on a carrier;
- after mounting each die, electrically coupling a first portion of each of a plurality of clips carried by a sacrificial substrate with an electrode of a corresponding one of the semiconductor die and with respective contact pads on the carrier;
- and
- removing the sacrificial substrate from the clips.
A semiconductor package comprising:
- a semiconductor die having a first electrode and a second electrode respectively on first and second opposing surfaces thereof;
- a carrier supporting the semiconductor die, the carrier including a first contact pad and at least one device region having a die attach pad coupled with the semiconductor die via the first electrode at the first surface, the second electrode of the semiconductor die being exposed when the semiconductor die is coupled with the die attach pad;
- and
- a first clip electrically coupling the first contact pad with the second electrode of the semiconductor die, the first clip being supported by a sacrificial substrate configured and arranged for selective removal relative to the first clip.
Dependencies are inferred from the claim text.