Semiconductor devices having exposed clip top sides and methods of manufacturing semiconductor devices

A method of manufacturing an electronic device, comprising:

• coupling a first electronic component to a substrate;
• providing a clip structure comprising:
• a first clip;
• a second clip;
• and
• a clip connector coupled to the first clip and the second clip;
• coupling the first clip to a first component terminal of the first electronic component;
• coupling the second clip to a first terminal of the substrate;
• providing an encapsulant over the first electronic component, the substrate, and the clip structure;
• and
• removing at least a portion of the clip connector to separate the first clip from the second clip and expose the first clip and the second clip from a top side of the encapsulant.

An electronic device, comprising:

• a first electronic component coupled to a first side of a substrate, the first electronic component comprising a first component terminal and a second component terminal located on a first major side of the first electronic component;
• a clip structure comprising:
• a first clip coupled to the first component terminal;
• a second clip coupled to a first terminal of the substrate;
• a connector first portion coupled to the first clip;
• and
• a connector second portion coupled to the and separated from the connector first portion by a gap;
• and
• an encapsulant covering the first electronic component, portions of the substrate, and portions of the clip structure;
• wherein:
• a top side of the first clip and a top side of the second clip are exposed from a top side of the encapsulant.