Molding material and method for packaging semiconductor chips
AssigneeInfineon Technologies AG
InventorsKok Chai Goh, Meng Tong Ong
Life of this patent
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Abstract
A method and apparatus for packaging a semiconductor chip is presented. A semiconductor device includes a chip, a lead, and an encapsulant. The encapsulant includes a stabilization layer, a laminate molding layer connected to the stabilization layer, and a conductive strip connected to the laminate molding layer. The conductive strip electrically connects the contact area of the chip to the lead.
Claims23
A method for packaging a semiconductor device, the method comprising:
- attaching a chip to a lead frame;
- aligning a molding material on the lead frame and the chip, wherein the molding material comprises a stabilization layer, a laminate molding layer connected to the stabilization layer, and a plurality of conductive strips connected to the laminate molding layer such that each conductive strip is aligned with a respective contact area on the chip;
- and
- encapsulating the chip and the lead frame by attaching the molding material to the lead frame and the chip such that ones of the conductive strips electrically connect the chip to leads of the lead frame.
A method for packaging a semiconductor device, the method comprising:
- providing a carrier with a plurality of conductive strips attached thereto;
- attaching the conductive strips between contact areas of a chip and leads;
- removing the carrier;
- encapsulating the chip and the conductive strips with a molding material to form a semiconductor chip package;
- providing a chip carrier that includes the chip and the leads;
- before attaching the conductive strips, applying a sacrificial coating to the chip and the leads on the chip carrier;
- and
- after attaching the conductive strips, removing the sacrificial coating.
A method for packaging a semiconductor device, the method comprising:
- forming a plurality of leads on a chip carrier;
- placing a plurality of chips on the chip carrier;
- aligning a strip carrier with the chip carrier, wherein
- the strip carrier comprises conductive strips and a coating material, and
- the strip carrier is aligned with the chip carrier such that the conductive strips of the strip carrier are aligned to electrically connect contact regions of the chips with respective ones of the leads;
- attaching the strip carrier to the chip carrier such that the coating material of the strip carrier encapsulates the chips and so that the conductive strips electrically connect the contact regions of the chips with the respective ones of the leads;
- and
- removing the chip carrier so as to expose a portion of each of the leads.
A method for packaging a semiconductor device, the method comprising:
- providing a chip including a contact area;
- providing a lead;
- and
- forming an encapsulant, the encapsulant comprising a stabilization layer, a laminate molding layer connected to the stabilization layer and a conductive strip connected to the laminate molding layer, wherein the conductive strip electrically connects the contact area of the chip to the lead.
Dependencies are inferred from the claim text.