H10W 72/07604
The auxiliary member being temporary
Official title: {the auxiliary member being temporary, e.g. a sacrificial coating}
H10W72/07604 (The auxiliary member being temporary) appears on 18 US grants and 26 published applications in this corpus.
Search patents in H10W- Granted patents
- 18
- Published applications
- 26
- Assignees
- 22
- Inventors
- 76
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 1 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 1 |
| 2015 | 1 | 1 |
| 2016 | 0 | 0 |
| 2017 | 1 | 2 |
| 2018 | 2 | 3 |
| 2019 | 1 | 1 |
| 2020 | 0 | 3 |
| 2021 | 2 | 2 |
| 2022 | 4 | 6 |
| 2023 | 1 | 0 |
| 2024 | 0 | 1 |
| 2025 | 3 | 4 |
| 2026 | 2 | 0 |
By publication year. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Clip interconnect with micro contact heads2 Jun 2026US 12,648,455 B2Semiconductor Components Industries, LLC
- Semiconductor device and method of forming clip bond having multiple bond line thicknesses13 Jan 2026US 12,525,567 B2UTAC Headquarters Pte. Ltd.
- Semiconductor device and method of forming leadframe with clip bond for electrical interconnect6 May 2025US 12,293,972 B2UTAC Headquarters Pte. Ltd.
- Fingerprint sensor package and smart card having the same6 May 2025US 12,294,000 B2Samsung Electronics Co., Ltd.
- Semiconductor device and methods of manufacturing semiconductor devices25 Mar 2025US 12,261,145 B2Amkor Technology Singapore Holding Pte.Ltd.
- Method of forming a die package and die package2 Oct 2025US 2025/0308942 A1Infineon Technologies AG
- Semiconductor device and method of manufacturing the same17 Jul 2025US 2025/0233107 A1Fuji Electric Co., Ltd.
- Semiconductor device and methods of manufacturing semiconductor devices12 Jun 2025US 2025/0192093 A1Amkor Technology Singapore Holding Pte.Ltd.
- Electronic package module and method for fabrication of the same6 Mar 2025US 2025/0079414 A1Universal Global Technology (Kunshan) Co., Ltd.
- Fingerprint sensor package and smart card having the same28 Mar 2024US 2024/0105703 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Methods of packaging a semiconductor die and package formed by the methods36US 8,183,682 B2NXP B. V. · 2012
- Multi-chip module clips with connector bar6US 9,935,041 B1Texas Instruments Incorporated · 2018
- Molding material and method for packaging semiconductor chips4US 9,209,152 B2Infineon Technologies AG · 2015
- Multi-clip structure for die bonding1US 11,189,592 B2Infineon Technologies Austria AG · 2021
- Semiconductor device and methods of manufacturing semiconductor devices1US 11,355,470 B2Amkor Technology Singapore Holding Pte.Ltd. · 2022