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US 11,189,592 B2Granted
Multi-clip structure for die bonding
AssigneeInfineon Technologies Austria AG
InventorsBalehithlu Manjappaiah Upendra, Dexter Reynoso
Life of this patent
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Abstract
A multi-clip structure includes a first clip for die bonding and a second clip for die bonding. The multi-clip structure further includes a retaining tape fixed to the first clip and to the second clip to hold the first clip and the second clip together.
Claims12
A multi-clip structure comprising:
- a first clip for die bonding;
- a second clip for die bonding;
- and
- a retaining tape fixed to the first clip and to the second clip to hold the first clip and the second clip together.
1 more element
A semiconductor device package comprising:
- a die carrier;
- a die mounted on the die carrier;
- a first clip bonded to a first electrode of the die;
- a second clip bonded to the first electrode or a second electrode of the die;
- a mold compound encapsulating the die, the first clip and the second clip, wherein the first clip and the second clip are cast-in-place by the mold compound and are completely encapsulated by the mold compound;
- and
- a retaining tape fixed to the first clip and to the second clip.
4 more elements
Dependencies are inferred from the claim text.