Fingerprint sensor package and smart card having the same

A fingerprint sensor package comprising:

• a first substrate including a core insulating layer including a first surface and an opposite second surface, the first substrate including a through-hole, a first bonding pad extending along a circumference of the through-hole on the second surface, and an external connection pad on an edge of the second surface;
• a second substrate including a third surface including a sensing region and a peripheral region surrounding the sensing region and a fourth surface opposite to the third surface, and including a second bonding pad extending along an edge of the fourth surface;
• a conductive support vertically overlapping the first substrate and the second substrate, supporting the first substrate and the second substrate below the first substrate and the second substrate, and electrically connecting the first bonding pad and the second bonding pad to each other;
• and
• a controller chip on the fourth surface.

A smart card comprising:

• a card body including a groove region and a contact pad;
• a security chip in the card body;
• and
• a fingerprint sensor package configured to sense a user's fingerprint and transmit a signal for a sensing result to the security chip,
• wherein the fingerprint sensor package includes:
• a first substrate including a core insulating layer including a first surface and a second surface, opposite to each other, and having a substantially rectangular or square ring shape with a through-hole passing through the first and second surfaces, a first bonding pad disposed along a circumference of the through-hole on the second surface of the core insulating layer, and an external connection pad between an edge of the second surface of the core insulating layer and the first bonding pad;
• a second substrate in the through-hole of the core insulating layer and including a third surface and a fourth surface, opposite to each other, and including a plurality of first sensing patterns spaced apart in a first direction and extending in a second direction, perpendicular to the first direction, a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction, and a second bonding pad;
• a conductive support vertically overlapping the first substrate and the second substrate, supporting the first substrate and the second substrate below the first substrate and the second substrate, and electrically connecting the first bonding pad and the second bonding pad to each other;
• a controller chip on the second substrate;
• and
• a molding layer on the second surface of the core insulating layer, filling the through-hole between the first substrate and the second substrate, at least partially covering the second substrate and the first bonding pad, and spaced apart from the external connection pad.