H10W 72/07607
The auxiliary member being a temporary substrate
Official title: {the auxiliary member being a temporary substrate, e.g. a removable substrate}
H10W72/07607 (The auxiliary member being a temporary substrate) appears on 11 US grants and 15 published applications in this corpus.
Search patents in H10W- Granted patents
- 11
- Published applications
- 15
- Assignees
- 14
- Inventors
- 51
- Latest grant
- 6 May 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2014 | 0 | 1 |
| 2015 | 1 | 1 |
| 2016 | 0 | 0 |
| 2017 | 1 | 2 |
| 2018 | 2 | 2 |
| 2019 | 1 | 0 |
| 2020 | 0 | 3 |
| 2021 | 1 | 1 |
| 2022 | 2 | 3 |
| 2023 | 1 | 0 |
| 2024 | 0 | 1 |
| 2025 | 2 | 1 |
By publication year.
Recent patents
- Semiconductor device and method of forming leadframe with clip bond for electrical interconnect6 May 2025US 12,293,972 B2UTAC Headquarters Pte. Ltd.
- Fingerprint sensor package and smart card having the same6 May 2025US 12,294,000 B2Samsung Electronics Co., Ltd.
- Split tie bar for clip stability29 Aug 2023US 11,742,318 B2Texas Instruments Incorporated
- Cascode power electronic device packaging method and packaging structure thereof18 Oct 2022US 11,476,242 B2Ultraband Technologies, Inc.
- Batch manufacture of packages by sheet separated into carriers after mounting of electronic components1 Mar 2022US 11,264,356 B2Infineon Technologies AG
- Electronic package module and method for fabrication of the same6 Mar 2025US 2025/0079414 A1Universal Global Technology (Kunshan) Co., Ltd.
- Fingerprint sensor package and smart card having the same28 Mar 2024US 2024/0105703 A1Samsung Electronics Co., Ltd.
- Split tie bar for clip stability27 Oct 2022US 2022/0344302 A1Texas Instruments Incorporated
- Installing an Electronic Assembly8 Sep 2022US 2022/0285311 A1Siemens Aktiengesellschaft
- Semiconductor Device and Method of Forming Leadframe with Clip Bond for Electrical Interconnect30 Jun 2022US 2022/0208686 A1UTAC Headquarters Pte. Ltd.
Most cited
By later US patents
- Multi-chip module clips with connector bar6US 9,935,041 B1Texas Instruments Incorporated · 2018
- Molding material and method for packaging semiconductor chips4US 9,209,152 B2Infineon Technologies AG · 2015
- Multi-clip structure for die bonding1US 11,189,592 B2Infineon Technologies Austria AG · 2021
- Split tie bar for clip stability1US 11,742,318 B2Texas Instruments Incorporated · 2023