Split tie bar for clip stability

A method of assembling a packaged power device, comprising:

• attaching a power semiconductor device comprising a vertical field effect transistor (FET) or an Isolated Gate Bipolar Transistor (IGBT) to a die pad of a leadframe that also includes lead terminals;
• attaching a first clip to the lead terminals, wherein the first clip comprising a metal having a center region oriented along a first plane and an angled clip foot having a foot height, a foot length and a bend angle sufficient to electrically contact the lead terminals, a first tie bar connected to the first clip also oriented along the first plane and extending to a saw street region, a second tie bar attached to the first tie bar positioned in the saw street region, and the second tie bar physically contacts the leadframe in the saw street region;
• and
• covering the packaged power device with a mold compound.

A method of assembling a packaged power device, comprising:

• attaching a first power semiconductor device comprising a first vertical field effect transistor (FET) or a first Isolated Gate Bipolar Transistor (IGBT) to a first die pad of a leadframe that also includes lead terminals;
• attaching a first clip to the lead terminals, wherein the first clip comprising a metal having a center region oriented along a first plane and an angled bottom clip foot having a bottom foot height, a bottom foot length and a bottom bend angle sufficient to electrically contact the lead terminals, a first bottom tie bar connected to the first clip also oriented along the first plane and extending to a saw street region, a second bottom tie bar attached to the first tie bar positioned in the saw street region, and the second bottom tie bar physically contacts the leadframe in the saw street region;
• attaching a second power semiconductor device comprising a second vertical FET or a second IGBT on the first clip;
• attaching a second clip over the second power semiconductor device comprising a metal having a center region oriented along the first plane and an angled top clip foot having a top foot height, a top foot length and a top bend angle sufficient to electrically contact the lead terminals, with a first top tie bar connected to the second clip also oriented along the first plane and extending to the saw street region, a second top tie bar attached to the second bottom tie bar positioned in the saw street region, wherein the second top tie bar physically contacts the first clip in the saw street region;
• and
• covering the power device with a mold material.

A method of assembling a packaged power device, comprising:

• attaching a first power semiconductor device comprising a first vertical field effect transistor (FET) or a first Isolated Gate Bipolar Transistor (IGBT) to a first die pad of a leadframe that also includes lead terminals;
• attaching a first clip to the lead terminals, wherein the first clip comprising a metal having a center region oriented along a first plane and an angled bottom clip foot having a bottom foot height, a bottom foot length and a bottom bend angle sufficient to electrically contact the lead terminals, a first bottom tie bar connected to the first clip also oriented along the first plane and extending to a saw street region, a second bottom tie bar attached to the first bottom tie bar positioned in the saw street region, and the second bottom tie bar physically contacts the leadframe in the saw street region;
• attaching a second power semiconductor device comprising a second vertical FET or a second IGBT on the first clip;
• attaching a second clip over the second power semiconductor device comprising a metal having a center region oriented along the first plane and an angled top clip foot having a top foot height, a top foot length and a top bend angle sufficient to electrically contact the lead terminals, with a first top tie bar connected to the second clip also oriented along the first plane and extending to the saw street region, a second top tie bar attached to the second bottom tie bar positioned in the saw street region, wherein the second top tie bar physically contacts the first clip in the saw street region;
• positioning a second die pad lateral to the first die pad;
• attaching a controller die with its top side having bond pads up to the second die pad;
• bonding wires between the bond pads and leads of the leadframe that are electrically connected to terminals of the first power semiconductor device by the first clip and to terminals of the second power semiconductor device by the second clip;
• and
• covering the power device with a mold material.