Batch manufacture of packages by sheet separated into carriers after mounting of electronic components
AssigneeInfineon Technologies AG
InventorsThorsten Meyer, Thomas Behrens, Andreas Grassmann, Martin Gruber, Thorsten Scharf
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Abstract
A method of manufacturing packages is disclosed. In one example, the method comprises providing an electrically conductive sheet being continuous at least in a mounting region, mounting first main surfaces of a plurality of electronic components on the continuous mounting region of the sheet and forming interconnect structures for electrically coupling second main surfaces of the electronic components with the sheet. The second main surfaces oppose the first main surfaces. After the forming, structuring the sheet.
Claims21
A method of manufacturing packages, wherein the method comprises:
- providing an electrically conductive sheet having two planar opposing main surfaces being continuous at least in a mounting region;
- mounting first main surfaces of a plurality of electronic components on an exposed first one of the two planar main surfaces in the continuous mounting region of the sheet;
- forming interconnect structures for directly electrically coupling second main surfaces of the electronic components with the first one of the two planar main surfaces of the sheet, wherein the second main surfaces of the electronic components oppose the first main surfaces of the electronic components;
- at least partially encapsulating the electronic components and the interconnect structures by an encapsulant;
- after the encapsulating, structuring the sheet;
- and
- singularizing a structure, obtained after structuring the sheet, into separate packages by removing material of the encapsulant without removing material of the sheet.
A method of manufacturing packages, wherein the method comprises:
- providing an electrically conductive substantially continuous sheet having two planar opposing main surfaces;
- mounting a plurality of electronic components, having a vertical current flow through the electronic component during operation such that current flows through a lower main surface and an upper main surface of the electronic component, on a first one of the two planar main surfaces of the sheet;
- at least partially encapsulating the electronic components by an encapsulant;
- and
- after the encapsulating, patterning the sheet from a non-encapsulated back side of the sheet to thereby form individual carriers for each package.
A package, comprises:
- a carrier having two planar opposing main surfaces structured into a plurality of sub-structures spaced by at least one gap;
- at least one electronic component mounted with its lower main surface on the carrier;
- at least one interconnect structure electrically coupling an upper main surface of the at least one electronic component with the carrier;
- and
- an encapsulant at least partially encapsulating the at least one electronic component and partially encapsulating the carrier in such a way that the at least one gap is non-encapsulated,
- wherein the at least one electronic component experiences a vertical current flow through the at least one electronic component during operation such that current flows through the lower main surface and the upper main surface of the at least one electronic component.
Dependencies are inferred from the claim text.