Split tie bar for clip stability
AssigneeTexas Instruments Incorporated
InventorsDolores Babaran Milo, Ernesto Pentecostes Rafael, JR., Michael Flores Milo
Life of this patent
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Abstract
A gang clip includes a plurality of clips formed from a metal each having a center region oriented along a first plane and an angled clip foot having a foot height, a length and a bend angle sufficient to electrically contact a lead terminal of the leadframe to be used to form a device. Adjacent ones of the plurality of clips are joined to one another by a first tie bar also oriented along the first plane. The first tie bar extends to a saw street region located between adjacent ones of the clips. A second tie bar attached to the first tie bar is positioned in the saw street region.
Claims20
A gang clip, comprising:
- a plurality of clips comprising a metal each having a center region oriented along a first plane and an angled clip foot having a foot height, a foot length and a bend angle sufficient to make an electrically contact to a lead terminal of a leadframe to be used to form a device, wherein adjacent ones of the plurality of clips are joined to one another by a first tie bar also oriented along the first plane;
- the first tie bar extending to a saw street region located between adjacent ones of the plurality of clips;
- a second tie bar attached to the first tie bar positioned in the saw street region.
A method of assembling a packaged power device, comprising:
- attaching a power semiconductor device comprising a vertical field effect transistor (FET) or an Isolated Gate Bipolar Transistor (IGBT) to a die pad of a leadframe that also includes lead terminals;
- attaching a first clip comprising a metal having a center region oriented along a first plane and an angled clip foot having a foot height, a foot length and a bend angle sufficient to electrically contact the lead terminals, with a first tie bar connected to the first clip also oriented along the first plane extending to a saw street region, and a second tie bar attached to the first tie bar positioned in the saw street region, wherein the second tie bar physically contacts the leadframe in the saw street region, and
- molding to form a mold compound for encapsulating the packaged power device.
A method of assembling a packaged power device, comprising:
- attaching a first power semiconductor device comprising a first vertical field effect transistor (FET) or a first Isolated Gate Bipolar Transistor (IGBT) to a first die pad of a leadframe that also includes lead terminals;
- attaching a first clip comprising a metal having a center region oriented along a first plane and an angled bottom clip foot having a bottom foot height, a bottom foot length and a bottom bend angle sufficient to electrically contact the lead terminals, with a first bottom tie bar connected to the first clip also oriented along the first plane extending to a saw street region, and a second bottom tie bar attached to the first tie bar positioned in the saw street region, wherein the second bottom tie bar physically contacts the leadframe in the saw street region;
- attaching a second power semiconductor device comprising a second vertical FET or a second IGBT on the first clip;
- attaching a second clip over the second power semiconductor device comprising a metal having a center region oriented along the first plane and an angled top clip foot having a top foot height, a top foot length and a top bend angle sufficient to electrically contact the lead terminals, with a first top tie bar connected to the second clip also oriented along the first plane extending to the saw street region, and a second top tie bar attached to the second tie bar positioned in the saw street region, wherein the second top tie bar physically contacts the first clip in the saw street region, and
- molding to form a mold compound for encapsulating the power device.
Dependencies are inferred from the claim text.