Semiconductor device and method of forming leadframe with clip bond for electrical interconnect

A semiconductor device, comprising:

• a leadframe, wherein a portion of the leadframe is exposed from a first surface of the semiconductor device;
• a first electrical component disposed on the leadframe;
• and
• a clip bond including a horizontal member disposed over a second surface of the first electrical component and a first vertical member extending from the horizontal member and exposed from a second surface of the semiconductor device opposite the first surface of the semiconductor device, wherein the clip bond includes,
• (a) a second vertical member extending from the horizontal member and exposed from the first surface of the semiconductor device, and
• (b) a die contact integrated with the horizontal member over the first electrical component.

A method of making a semiconductor device, comprising:

• providing a leadframe;
• disposing a first electrical component including a first surface on the leadframe;
• and
• disposing a clip bond over a second surface of the first electrical component opposite the first surface of the first electrical component, wherein the clip bond extends vertically from a first surface of the semiconductor device to a second surface of the semiconductor device opposite the leadframe with a horizontal member disposed over the second surface of the first electrical component and a first vertical member extending from the horizontal member and exposed from the second surface of the semiconductor device.

A semiconductor device, comprising:

• a leadframe, wherein a portion of the leadframe is exposed from a first surface of the semiconductor device;
• a first electrical component disposed on the leadframe;
• a first clip bond disposed over the first electrical component, wherein the first clip bond includes,
• (a) a horizontal member,
• (b) a vertical member extending from the horizontal member and exposed from the second surface of the semiconductor device, and
• (c) a die contact integrated with the horizontal member over the first electrical component;
• a second electrical component disposed over the first clip bond;
• and
• a second clip bond disposed over the second electrical component, wherein the second clip bond includes a horizontal member disposed over the second electrical component and a vertical member extending from the horizontal member and exposed from a second surface of the semiconductor device opposite the first surface of the semiconductor device.

A semiconductor device, comprising:

• a leadframe exposed from a first surface of the semiconductor device;
• a plurality of first electrical components disposed over the leadframe;
• a first clip bond disposed over a first one of the first electrical components, wherein the first clip bond includes,
• (a) a horizontal member,
• (b) a vertical member extending from the horizontal member and exposed from the second surface of the semiconductor device, and
• (c) a die contact integrated with the horizontal member over the first one of the first electrical components;
• and
• a second clip bond disposed over a second one of the first electrical components, wherein the second clip bond includes a horizontal member disposed over the second one of the first electrical components and a vertical member extending from the horizontal member and exposed from a second surface of the semiconductor device opposite the first surface of the semiconductor device.