Electronic package module and method for fabrication of the same

A method for fabricating an electronic package module, comprising:

• providing an electronic component assembly including a first electronic component, a second electronic component, a conductive structure and three conductive adhesive materials, wherein the first electronic component is connected to the second electronic component through one of the conductive adhesive materials, and the second electronic component is connected to the conductive structure through another one of the conductive adhesive materials, and the first electronic component is connected to the conductive structure through the other one of the conductive adhesive materials;
• providing a circuit substrate;
• forming a soldering material on the circuit substrate, wherein the melting point of at least two of the conductive adhesive materials is higher than the melting point of the soldering material;
• and
• disposing the electronic component assembly on the soldering material after the soldering material is formed, wherein the soldering material is located between the first electronic component and the circuit substrate, and the electronic component assembly is electrically connected to the circuit substrate through the soldering material.

An electronic package module, comprising:

• a circuit substrate;
• a first electronic component disposed on the circuit substrate;
• a second electronic component disposed on the first electronic component, wherein the first electronic component is located between the circuit substrate and the second electronic component;
• a conductive structure disposed on the second electronic component and connected to the second electronic component and the circuit substrate;
• two conductive adhesive materials, and one of the conductive adhesive materials is located between the first electronic component and the second electronic component, and the other one of the conductive adhesive materials is located between the second electronic component and the conductive structure, wherein the second electronic component is electrically connected to the first electronic component through the one of the conductive adhesive materials and is electrically connected to the conductive structure through the other one of the conductive adhesive materials;
• and
• a soldering material located between the circuit substrate and the first electronic component, wherein the circuit substrate is electrically connected to the first electronic component through the soldering material, and the melting point of the conductive adhesive materials is higher than the melting point of the soldering material.

An electronic package module, comprising:

• a circuit substrate;
• a first electronic component disposed on the circuit substrate;
• a second electronic component disposed on the first electronic component, wherein the first electronic component is located between the circuit substrate and the second electronic component;
• a conductive structure disposed on the second electronic component and the first electronic component, wherein the conductive structure is connected to the second electronic component and the circuit substrate and is connected to the second electronic component and the first electronic component;
• three conductive adhesive materials, and one of the conductive adhesive materials is located between the first electronic component and the second electronic component, and another one of the conductive adhesive materials is located between the second electronic component and the conductive structure, and the other one of the conductive adhesive materials is located between the first electronic component and the conductive structure, wherein the first electronic component is electrically connected to the conductive structure through the one of the conductive adhesive materials, wherein the second electronic component is electrically connected to the first electronic component and the conductive structure separately through the other two of the conductive adhesive materials;
• and
• a soldering material located between the circuit substrate and the first electronic component, wherein the circuit substrate is electrically connected to the first electronic component through the soldering material, and the melting point of at least two of the conductive adhesive materials is higher than the melting point of the soldering material.