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US 12,648,455 B2Granted
Clip interconnect with micro contact heads
AssigneeSemiconductor Components Industries, LLC
InventorsEmmanuel Silvestre Ramos, Ghizelle Jane Estrada Abarro, Aaron Alabin Bitavarra, Roxanna Samson Caguioa
Life of this patent
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Abstract
A furcated clip includes a removable collar, and an arrangement of stems attached to the removable collar. The stems are configured for contacting bond pads of a semiconductor die and connecting the bond pads to leadframe posts of a leadframe structure.
Claims18
A device, comprising:
- a body of molding material that encapsulates a semiconductor die, a portion of a leadframe structure and a portion of a furcated clip, the furcated clip including an arrangement of stems and a collar;
- at least one stem of the arrangement of stems comprising a first portion and a second portion, the first portion attaching the second portion to the collar,
- the second portion including a base bonded to the leadframe structure and a needle tip bonded to the semiconductor die, the base including a base edge aligned in a first direction parallel to the collar;
- the second portion including a first side surface and a second side surface, the first side surface and the second side surface each extending from the base edge to the needle tip;
- wherein the second portion decreases in width from the base edge to the needle tip, the width at the needle tip being smaller than the width at the base edge, the width being measured in the first direction from the first side surface of the second portion to the second side surface of the second portion;
- the first portion including a first end attached to the collar, a second end attached to the base edge of the second portion, the second end of the first portion having a width smaller than the width of the second portion at the base edge;
- and
- the first portion including a first side surface and a second side surface, each of the first side surface of the first portion and the second side surface of the first portion extending between the first end and the second end of the first portion;
- and
- the collar is located outside of the body of molding material and each stem of the at least one stem extends from the collar and into the body of molding material to the semiconductor die with the first side surface and the second side surface of the first portion extending from outside of the molding material to inside of the molding material.
7 more elements
A device comprising:
- a semiconductor die;
- a leadframe structure;
- a furcated clip including a first stem, a second stem, and a collar;
- a body of molding material that encapsulates the semiconductor die, a portion of the leadframe structure and a portion of the furcated clip;
- the first stem including a first portion, a second portion, and a needle tip, the first portion attaching the second portion to the collar the second portion extending from the first portion to the needle tip;
- the second portion including a base that is bonded to a first leadframe post of the leadframe structure, wherein the second portion decreases in width from the base to the needle tip, the width measured in a first direction parallel to the collar from a first side surface of the second portion to a second side surface of the second portion;
- the first portion including a first side surface and a second side surface, each of the first side surface of the first portion and the second side surface of the first portion extending between the collar and the base of the second portion, the first portion having a width measured in the first direction from the first side surface of the first portion to the second side surface of the first portion;
- wherein the width of the second portion at the base is larger than the width of the first portion;
- wherein the needle tip includes a micro contact head bonded to a first bond pad on the semiconductor die;
- and
- the second stem including a band clip tip bonded to a second bond pad on the semiconductor die, the band clip tip having a width greater than a width of the needle tip;
- and
- the collar is located outside of the body of molding material and the first stem extends from the collar and into the body of molding material to the semiconductor die with the first portion extending from outside of the molding material to inside of the molding material.
10 more elements
Dependencies are inferred from the claim text.