Semiconductor device and methods of manufacturing semiconductor devices

A semiconductor device, comprising:

• a semiconductor component comprising:
• a component face side;
• a component base side;
• a component lateral side connecting the component face side to the component base side;
• a component port adjacent to the component face side, wherein the comprises a component port face;
• and
• a first component terminal on the component base side;
• a clip structure comprising:
• a first clip pad having a first clip face;
• a second clip pad having a second clip face;
• and
• a first clip leg connecting the first clip pad to the second clip pad;
• and
• an encapsulant covering portions of the semiconductor component and the clip structure;
• wherein:
• the encapsulant comprises a first encapsulant face and a second encapsulant face opposite to the first encapsulant face;
• the first clip pad is coupled to the component face side with a first interface material;
• the first interface material is electrically insulating;
• and
• the component port face and the first clip face are exposed from the first encapsulant face.

A method of forming a semiconductor device, comprising:

• providing a semiconductor component comprising:
• a component face side;
• a component base side;
• a component lateral side connecting the component face side to the component base side;
• a component port adjacent to the component face side and comprising a first component terminal on the component face side;
• and a first component interconnect coupled to the first component terminal, wherein the first component interconnect comprises a component port face;
• and
• a second component terminal on the component base side;
• providing a clip structure having a first clip face and a second clip face;
• coupling the clip structure to the component face side with a first interface material;
• providing an encapsulant covering portions of the semiconductor component and the clip structure;
• wherein:
• the first interface material is electrically insulating;
• the second clip face has an outer end proximate to a side of the encapsulant;
• the encapsulant comprises a first encapsulant face and a second encapsulant face opposite to the first encapsulant face;
• and
• the component port face and the first clip face are exposed from the first encapsulant face;
• and
• electrically coupling the second clip face to the second component terminal at the second encapsulant face.